Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Filimon Zacharatos"'
Autor:
Kostas Andritsos, Ioannis Theodorakos, Filimon Zacharatos, Ayala Kabla, Semyon Melamed, Fernando de la Vega, Yoann Porte, Patrick Too, Ioanna Zergioti
Publikováno v:
Virtual and Physical Prototyping, Vol 18, Iss 1 (2023)
The laser induced forward transfer and sintering of metal nanoparticle inks has been proven a key enabling technology for flexible electronics. Nevertheless, many challenges concerning the conformal processing of non-planar substrates incorporating
Externí odkaz:
https://doaj.org/article/1bf3c403bf1b4d8abedcaa4fb92f4780
Autor:
Kostas Andritsos, Ioannis Theodorakos, Filimon Zacharatos, Ayala Kabla, Semyon Melamed, Fernando de la Vega, Yoann Porte, Patrick Too, Ioanna Zergioti
Publikováno v:
Materials Today: Proceedings. 70:714-717
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 27:1-8
Current trends in microelectronics chip bonding and assembly encompass ultra-fine pitch components with flexible form factors and advanced die-attach materials, which can sustain conformal strain without compromise in adhesion and reliability. These
Autor:
Kostas Andritsos, Ioannis Theodorakos, Filimon Zacharatos, Ayala Kabla, Semyon Melamed, Fernando de la Vega, Yoann Porte, Patrick Too, Ioanna Zergioti
Publikováno v:
Virtual and Physical Prototyping. 18
Autor:
Kostas Andritsos, Ioannis Theodorakos, Filimon Zacharatos, Ayala Kabla, Semyon Melamed, Fernando de la Vega, Yoann Porte, Patrick Too, Ioanna Zergioti
Publikováno v:
Laser 3D Manufacturing IX.
Autor:
Mado Logotheti, Symeon Papazoglou, Leonidas Tsetseris, Filimon Zacharatos, Ioanna Zergioti, Dimitris Kaltsas
Publikováno v:
Synthesis and Photonics of Nanoscale Materials XVII.
Publisher’s Note: This conference presentation, originally published on 9 March 2020, was withdrawn on 20 May 2021 per author request.
Autor:
Ioanna Zergioti, Panagiotis Papadopoulos, Nikolaos Oikonomidis, Filimon Zacharatos, Dimitris Reppas, Marina Makrygianni, Ioannis Theodorakos, Christos Spandonidis
Publikováno v:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI.
Currently the most widely used technique for solder paste deposition is Surface Mount Technology (SMT), which involves the printing of solder paste using a stencil, onto printed circuit board (PCB) interconnection pads. However, this process accounts
Autor:
Ioanna Zergioti, Filimon Zacharatos, Adamantia Logotheti, Symeon Papazoglou, Dimitrios Kaltsas, Leonidas Tsetseris
Publikováno v:
Synthesis and Photonics of Nanoscale Materials XVIII.
Publisher’s Note: This conference presentation, originally published on 5 March 2021, was withdrawn on 20 May 2021 per author request.
Autor:
Dimitris Karnakis, Fernando De La Vega, Filimon Zacharatos, Marina Makrygianni, Ayala Kabla, Riccardo Geremia, Jonathan Ankri, Nuno Braz, Shane Norval, Olga Koritsoglou, Semyon Melamed, Agamemnonas Kalaitzis, Arye Schwarzbaum, Alon Melamed, Simon Tuohi, Daniel Arnaldo, Ioannis Theodorakos, Brian Cobb, Merijn Giesbers, Ioanna Zergioti, Gari Arutinov, Richard Price, Darshana Kariyapperuma, Patrick Too
Publikováno v:
Proceedings of SPIE-The International Society for Optical Engineering, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV 2020, 3 February 2020 through 5 February 2020
The recent developments in the field of large area, flexible and printed electronics have fueled substantial advancements in Laser Printing and Laser Sintering, which have been attracting interest over the past decade. Resulting applications, ranging
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c8cbbb07f0361ca03149b2eb1340b7b0
http://resolver.tudelft.nl/uuid:021f6160-25ba-40ee-a3ee-2650e85d65e3
http://resolver.tudelft.nl/uuid:021f6160-25ba-40ee-a3ee-2650e85d65e3
Autor:
Christos Spandonidis, Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, Ioannis Theodorakos, Ioanna Zergioti, Nikolaos Oikonomidis, Dimitris Reppas
Publikováno v:
Materials
Materials, Vol 14, Iss 3353, p 3353 (2021)
Volume 14
Issue 12
Materials, Vol 14, Iss 3353, p 3353 (2021)
Volume 14
Issue 12
Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (<
0.3 mm and <
60 μm respectively), high throughput and compatibility with flexible substrates, which are poo
0.3 mm and <
60 μm respectively), high throughput and compatibility with flexible substrates, which are poo