Zobrazeno 1 - 10
of 139
pro vyhledávání: '"Fenglian Sun"'
Publikováno v:
Crystals, Vol 14, Iss 3, p 269 (2024)
Sn58Bi solder is considered a promising lead-free solder that meets the performance requirements, with the advantages of good wettability and low cost. However, the low melting point characteristic of Sn58Bi poses a serious threat to the high-tempera
Externí odkaz:
https://doaj.org/article/23c906b30bdd4d5f94af7424ece57848
Publikováno v:
Journal of Materials Research and Technology, Vol 16, Iss , Pp 640-655 (2022)
This paper studied the behaviors of sintering between Ag nanoparticle (NP) and nanoflake (NF) in the same size by molecular dynamics simulation. Before the sintering simulation, the melting simulation of NF was carried out to calculate the melting po
Externí odkaz:
https://doaj.org/article/e277d0fbab7540e0a1efdd9df403c7c4
Publikováno v:
Results in Physics, Vol 12, Iss , Pp 712-717 (2019)
The nanoindentation test was conducted in this paper to investigate the indentation hardness, plasticity and initial creep properties of pressure sintered nanosilver joint at various test temperatures. The effects of strain rate on the indentation ha
Externí odkaz:
https://doaj.org/article/26f536aef19545e7b66bd25cd9009d09
Publikováno v:
Results in Physics, Vol 11, Iss , Pp 617-622 (2018)
In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints
Externí odkaz:
https://doaj.org/article/d7d01b8b96f44c0a8b547f2b0660a09e
Publikováno v:
Results in Physics, Vol 15, Iss , Pp - (2019)
In order to decrease the hardness and brittleness of eutectic Sn58Bi (SnBi) solder joint, Sn3.0Ag0.5Cu (SAC) bulk was added into SnBi/Cu by a two-step soldering process to obtain solder joint with superposition structure. The microstructure, shear be
Externí odkaz:
https://doaj.org/article/7f4cc5926556408db8cfc69e1d288f64
Publikováno v:
Results in Physics, Vol 13, Iss , Pp - (2019)
The wettability, interfacial reaction, microstructure and hardness of Sn58Bi (SnBi) solder paste on Cu, high-temperature Cu (H-Cu) and graphene-coated Cu (G-Cu) were investigated in this study. Experimental results indicate that the wettability of Sn
Externí odkaz:
https://doaj.org/article/e3f2b7d977c540a49c1c93b0e04a93d8
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:25025-25040
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0370910c7ff7b726f1944b1bdfc7747
https://doi.org/10.1007/s10854-022-09210-9
https://doi.org/10.1007/s10854-022-09210-9
Publikováno v:
Microelectronics International, 2016, Vol. 33, Issue 1, pp. 42-46.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/MI-04-2015-0034
Publikováno v:
Soldering & Surface Mount Technology. 35:1-8
Purpose The purpose of this paper is to study the temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints compared with Sn-5Sb/Cu and SAC305/Cu micro solder joints, which has important engineering and theoretical significan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7382748bf84f20f152f1b829fadbcd0
https://doi.org/10.1108/ssmt-07-2021-0044
https://doi.org/10.1108/ssmt-07-2021-0044
Publikováno v:
Soldering & Surface Mount Technology. 34:287-291
Purpose This paper aims to investigate the effect of the Cu, Ni and Ag addition in Sn5Sb-based alloy on the mechanical properties and its mechanism. Design/methodology/approach The micro-indentation, creeping test of the Cu/Sn5Sb–0.5Cu–0.1Ni–0.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abb43c16566d59086a352abd4dc5c46b
https://doi.org/10.1108/ssmt-09-2021-0061
https://doi.org/10.1108/ssmt-09-2021-0061