Zobrazeno 1 - 2
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pro vyhledávání: '"Feng-Yeang Chung"'
Autor:
Feng-Yeang Chung, 鍾豐仰
87
Changes in stress and temperature caused by microchip packaging are studied. Piezoresistive strain gauges are fabricated onto a chip prior to packaging, and used to measure the resulting stress and temperature. A test bar is used to determine
Changes in stress and temperature caused by microchip packaging are studied. Piezoresistive strain gauges are fabricated onto a chip prior to packaging, and used to measure the resulting stress and temperature. A test bar is used to determine
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/24475400061491503243
Autor:
Qing-Da Chen, Sheng-Wei Huang, Ming-Hsin Ho, Feng-Yeang Chung, Chun-Han Chu, Chi-Min Liao, Jenhwa Guo
Publikováno v:
2023 IEEE Underwater Technology (UT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97ca8ef7d2bb671c4ef903a1ae55ef87
https://doi.org/10.1109/ut49729.2023.10103386
https://doi.org/10.1109/ut49729.2023.10103386
