Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Feng Q. Liu"'
Autor:
Chenhao Ge, Feng Q. Liu, Yufei Chen, Mengqi Ye, Anja Rosenbusch, Kun Xu, Yuchun Wang, Alain Duboust, Sherry Xia, Wen-Chiang Tu, Lakshmanan Karuppiah
Publikováno v:
ECS Transactions. 19:73-79
Since the CMP process depends on chemical and mechanical effects, the interaction with the physical and chemical properties of the GST alloy play very important roles during the CMP process. In this paper, the impact of the CMP process on a soft GST
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3b534f5fdd396e62795920508a0db07
https://doi.org/10.1149/1.3123776
https://doi.org/10.1149/1.3123776
Autor:
Gabriele Harder, T. Don Tilley, Markus Haufe, Laurel L. Schafer, Shane S. H. Mao, Jonathan R. Nitschke, Feng-Q. Liu
Publikováno v:
Chemistry - A European Journal. 8:74-83
A series of silyl-terminated diynes of varying lengths and substitution patterns have been prepared. These diynes undergo zirconocene coupling with selective formation of trimeric macrocycles from linear alkynes, while nonlinear diynes give cyclodime
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed7dfbd81e3e06bbe655496493a1758c
https://doi.org/10.1002/1521-3765(20020104)8:1<74::aid-chem74>3.0.co
https://doi.org/10.1002/1521-3765(20020104)8:1<74::aid-chem74>3.0.co
Autor:
T. Don Tilley, Gabriele Harder, Feng-Q. Liu, Jonathan R. Nitschke, Markus Haufe, Laurel L. Schafer, Shane S. H. Mao
Publikováno v:
ChemInform. 33
A series of silyl-terminated diynes of varying lengths and substitution patterns have been prepared. These diynes undergo zirconocene coupling with selective formation of trimeric macrocycles from linear alkynes, while nonlinear diynes give cyclodime
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7ed280ed53ac80d584699b841ab9a77
https://doi.org/10.1002/chin.200219075
https://doi.org/10.1002/chin.200219075
Publikováno v:
MRS Proceedings. 991
Planarization efficiency is a key parameter to evaluate the process effectiveness of CMP. When the Cu thickness was removed beyond the step height, under certain conditions, the recessed trenches become protruded, resulting in reverse topography. Thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9289fad825d33ba97199bca7d81da9cd
https://doi.org/10.1557/proc-0991-c11-03
https://doi.org/10.1557/proc-0991-c11-03
Autor:
Feng Q. Liu, Stan D. Tsai, W. Lu, Liang-Yuh Chen, M. Naujok, Antoine P. Manens, J. Salfelder, X. Sakamoto, X. Wang, R. Knarr, Alain Duboust, Y. Moon, L. Economikos, P. Ong, S. Shrauti, Siew Neo, W. Swart
Publikováno v:
Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).
A novel copper (Cu) planarization process, Ecmp, integrating electro-chemical mechanical polishing capability on a 300mm CMP platform with low down force conventional polishing processes is being developed and evaluated on low-k CVD devices. In the i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72f5a4b567503385ffc8685bd55512b1
https://doi.org/10.1109/iitc.2004.1345759
https://doi.org/10.1109/iitc.2004.1345759
Autor:
Laurel L, Schafer, Jonathan R, Nitschke, Shane S H, Mao, Feng-Q, Liu, Gabriele, Harder, Markus, Haufe, T Don, Tilley
Publikováno v:
Chemistry (Weinheim an der Bergstrasse, Germany). 8(1)
A series of silyl-terminated diynes of varying lengths and substitution patterns have been prepared. These diynes undergo zirconocene coupling with selective formation of trimeric macrocycles from linear alkynes, while nonlinear diynes give cyclodime
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::5ca80eea5abacd71131890b15a025a61
https://pubmed.ncbi.nlm.nih.gov/11826866
https://pubmed.ncbi.nlm.nih.gov/11826866
Publikováno v:
Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).
Traditional slurry copper (Cu) CMP processes have disadvantages in terms of dishing, erosion, Cu and oxide losses, micro-scratches and cost due in part to the presence of abrasive particles during polishing. A stable abrasive-free (AF) Cu CMP process
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0aa3a0732ab3b9268b903160c7b48f0
https://doi.org/10.1109/iitc.2001.930039
https://doi.org/10.1109/iitc.2001.930039
Autor:
Feng Q Liu, Chenhao Ge, Kun Xu, Mengqi Ye, Yuchun Wang, Yufei Chen, Sherry Xia, Alain Duboust, Wen-Chiang Tu, Lakshmanan Karuppiah
Publikováno v:
ECS Meeting Abstracts. :741-741
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a45e19d6d47211bb78639e63588744c9
https://doi.org/10.1149/ma2009-01/16/741
https://doi.org/10.1149/ma2009-01/16/741
Publikováno v:
Journal of The Electrochemical Society. 153:C377
The electrochemical mechanical planarization (Ecmp) process is a revolutionary planarization technology uniquely combining removal rate controlled by charge with superior planarization efficiency in the near no-shear regime. A planarization mechanism
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a22d66a09b5a059914a2d7bf080a780
https://doi.org/10.1149/1.2186180
https://doi.org/10.1149/1.2186180