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Publikováno v:
Components, Packaging, and Manufacturing Technology, IEEE Transactions on; 2024, Vol. 14 Issue: 5 p862-871, 10p
Publikováno v:
In Journal of Alloys and Compounds 2008 459(1):407-409
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Three-dimensional (3D) integration is considered as a good alternative solution to overcome the limitations of silicon scaling. Through Silicon Via (TSV) and wafer bonding are two key elements for 3D integration. This paper focuses on the realization
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88845623ae9a509f6f72d14e6dd67050
https://doi.org/10.1109/icept.2016.7583291
https://doi.org/10.1109/icept.2016.7583291
Publikováno v:
2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC).
2.5D/3D integration has been attracting both academic and industry interests for extending the Moore's Low in recent years and several products using such technology have been emerged. This paper introduces the development progress of key process mod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdd385d9299f54108f1a2ffac7e062a5
https://doi.org/10.1109/edssc.2015.7285095
https://doi.org/10.1109/edssc.2015.7285095
Autor:
Song, Chongshen, Xue, Kai, Jiang, Feng, Li, Hengfu, Feng, Guangjian, Jing, Xiangmeng, Zhang, W.
Publikováno v:
2015 International Conference on Optical MEMS & Nanophotonics (OMN); 2015, p241-244, 4p
Synthesis of sulfur-doped TiO 2 by solvothermal method and its visible-light photocatalytic activity
Publikováno v:
In Journal of Alloys and Compounds 2009 471(1):L23-L25
Publikováno v:
In Journal of Alloys and Compounds 2008 461(1):L17-L19
Autor:
Liu, Suwen, Xiu, Zhiliang, Liu, Jian’an, Xu, Fengxiu, Yu, Weina, Yu, Jiaoxian, Feng, Guangjian
Publikováno v:
In Journal of Alloys and Compounds 2008 457(1):L12-L14
Publikováno v:
In Journal of Alloys and Compounds 2008 457(1):L9-L11