A comparative study of color sensors for inline color measurement of recyclates in injection molding.

Autor: Pöttinger, Magdalena, Marschik, Christian, Straka, Klaus, Fellner, Klaus, Steinbichler, Georg

Publikováno v: AIP Conference Proceedings; 2024, Vol. 3158 Issue 1, p1-6, 6p

Local damage simulations of printed circuit boards based on in‐plane cohesive zone parameters

Autor: Filipp Fuchs, Peter, Fellner, Klaus, Pinter, Gerald

Publikováno v: Circuit World, 2013, Vol. 39, Issue 2, pp. 60-66.

Externí odkaz: http://www.emeraldinsight.com/doi/10.1108/03056121311315774

Determination of cyclic mechanical properties of thin copper layers for PCB applications.

Autor: Fellner, Klaus, Fuchs, Peter F., Antretter, Thomas, Pinter, Gerald, Schongrundner, Ronald

Publikováno v: 2014 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2014, p1-7, 7p

Adhesion of printed circuit boards with bending and the effect of reflow cycles.

Autor: Schongrundner, Ronald, Cordill, Megan J., Berger, Julia, Kruckl, Hans-Peter, Fellner, Klaus, Krivec, Thomas, Kurz, Markus, Fuchs, Peter F., Maier, Gunther A.

Publikováno v: 2013 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2013, p1-8, 8p