Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Farn-Shiun Hwu"'
Autor:
Farn-Shiun Hwu, Hung-Lin Hsieh
Publikováno v:
Advances in Mechanical Engineering, Vol 5 (2013)
The thermal characteristics of an alternating current light-emitting diode (AC LED) chip based on a three-dimensional unsteady numerical simulation are discussed. In this model, the difficulties due to the tiny scale and extra-low aspect ratio of the
Externí odkaz:
https://doaj.org/article/f046687a401f4abdac890ae73e690a9e
Publikováno v:
IEEE Photonics Journal, Vol 5, Iss 2, Pp 6600515-6600515 (2013)
A 3-D numerical model has been developed to investigate the transient thermal, electrical, and optical output performance of a single-chip light-emitting diode (LED) with an interdigitated mesa geometry under dc operation and a multimicrochip LED und
Externí odkaz:
https://doaj.org/article/cf672d0f4374497f8946361b57db1d58
Publikováno v:
International Journal of Heat and Mass Transfer. 97:439-449
In this study, the movement of a silicone plug is actuated by the application of heat flux to one end of a capillary tube. The transient motion of the plug is investigated in a numerical simulation. The finite element method with the two-phase level
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe5bd228479f154b4eb6ce78b18e1d7c
https://doi.org/10.1016/j.ijheatmasstransfer.2015.11.098
https://doi.org/10.1016/j.ijheatmasstransfer.2015.11.098
Publikováno v:
International Journal of Heat and Mass Transfer. 83:721-730
The thermocapillary actuation behavior of a silicone droplet in a microchannel is numerically investigated in the present paper. The finite element method with the two-phase level set technique, which is ideally suitable for tracking the interfaces b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83060cf98390e6cde95d79edcdff4434
https://doi.org/10.1016/j.ijheatmasstransfer.2014.12.056
https://doi.org/10.1016/j.ijheatmasstransfer.2014.12.056
Publikováno v:
Journal of Lightwave Technology. 32:2643-2648
Many studies have introduced electrode patterns to improve current crowding and enhance the light output power of LEDs. This study conducted experimental and numerical analysis to investigate the influence of electrode design on the luminous efficien
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64658ef8fed9d5f786b48d6fc935282f
https://doi.org/10.1109/jlt.2014.2332413
https://doi.org/10.1109/jlt.2014.2332413
Autor:
Ho-Chih Cheng1, Farn-Shiun Hwu2 hfs@nanya.edu.tw
Publikováno v:
Advanced Composite Materials. 2006, Vol. 15 Issue 4, p385-402. 18p. 1 Black and White Photograph, 1 Diagram, 6 Charts, 8 Graphs.
Publikováno v:
Transactions of the Canadian Society for Mechanical Engineering. 37:765-773
A three-dimensional numerical model using the finite element method is proposed in the present study to accurately simulate the influences of the thermal resistance on the submount of an LED. In a system with adiabatic lateral boundaries, the interna
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a478054d614d97b08e56d54f0345512
https://doi.org/10.1139/tcsme-2013-0064
https://doi.org/10.1139/tcsme-2013-0064
An Appropriate Design in Dimensions of Submount with Extra-Low Thermal Resistance for High Power LED
Publikováno v:
Applied Mechanics and Materials. :824-828
A numerical simulation model to obtain the extra-low internal thermal resistance for submount of LED is presented. The 3-D numerical model for calculating thermal resistance is demonstrated on examining the aspect ratio of submount, the contact ratio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45cc2ba8a721bd855dc923115c0c946e
https://doi.org/10.4028/www.scientific.net/amm.284-287.824
https://doi.org/10.4028/www.scientific.net/amm.284-287.824
Publikováno v:
Light, Energy and the Environment.
The electrical and thermal behaviors of LED are systematically investigated using a numerical method. The focus is on how the temperature-dependent carrier recombination induces an efficiency droop. The thermal effect enhances the efficiency droop.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91ca7554ce9b566f7afccec29d7178da
https://doi.org/10.1364/fts.2016.jw4a.7
https://doi.org/10.1364/fts.2016.jw4a.7
Autor:
Chien Chieh Lee, Sheng-Han Tu, Farn Shiun Hwu, Gwo-Jiun Sheu, Jyh Chen Chen, S.Y. Kuo, Jenq Yang Chang, F.L. Lin
Publikováno v:
Solid-State Electronics. 54:1438-1443
In this study, several n-type electrode patterns were designed to evaluate the current spreading effects in high power ThinGaN light emitting diodes. A proposed three dimensional numerical simulation was used to investigate the current spreading dist
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66c684f1d4d92fe59e5ab8fbebe0e2a3
https://doi.org/10.1016/j.sse.2010.04.044
https://doi.org/10.1016/j.sse.2010.04.044