Zobrazeno 1 - 10
of 121
pro vyhledávání: '"Farhang Shadman"'
Autor:
Calliandra Stuffle, Farhang Shadman
Publikováno v:
Cleaner Engineering and Technology, Vol 9, Iss , Pp 100511- (2022)
Etching, cleaning, and rinsing of micro- and nano-scale features are important industrial processes in semiconductor manufacturing. This study focused on developing an adaptable process simulator that employs user-input criteria drawn from literature
Externí odkaz:
https://doaj.org/article/5400f8ad03f94f8c9cf1bfe65b84c54d
Autor:
Violeta Martínez, Farhang Shadman
Publikováno v:
Chemical Engineering Journal Advances, Vol 10, Iss , Pp 100254- (2022)
In the design and operation of industrial dehydrogenation reactors, loss of selectivity and catalyst deactivation caused by undesirable by-products are two critical issues. The hypothesis explored in this work has been that it is possible to address
Externí odkaz:
https://doaj.org/article/470531ddab2845e8888b9d06ea92932a
Publikováno v:
Journal of Applied Mathematics and Physics. :672-683
A comprehensive mathematical model is developed to simulate the interactions of the complex processes that take place in typical catalytic chemical reactors. This mathematical model includes correlations representing various modes of mass transport a
A Controlled Mixing Method for Stabilizing the Purity and Reducing the Waste in Gas Delivery Systems
Autor:
Junsheng Wu, Farhang Shadman
Publikováno v:
Advances in Chemical Engineering and Science. :11-26
The variation of impurity concertation in the ultra-high purity (UHP) gases, delivered from cryogenic storage tanks and transported through long pipes, is a major problem in systems like those used in semiconductor manufacturing facilities. A method
Publikováno v:
Advances in Chemical Engineering and Science. :223-238
A model is developed to simulate the processes that may cause run-away exothermic reactions in the downstream of typical deposition reactors used in semiconductor manufacturing. This process model takes into account various modes of mass and heat tra
Publikováno v:
Journal of Nanoparticle Research. 23
SiO2, CeO2, and Al2O3 nanoparticles (NPs) are used as abrasive particles in chemical and mechanical planarization (CMP), a key process in semiconductor fabrication. The CMP process generates high volumes of effluents containing abrasive NPs. Since no
Publikováno v:
Environmental Research. 164:452-458
The production and application of engineered nanoparticles (NPs) are increasing in demand with the rapid development of nanotechnology. However, there are concerns that some of these novel materials could lead to emerging environmental and health pro
Publikováno v:
Clean Technologies and Environmental Policy. 20:899-907
Removal of various soluble metallic impurities from wastewater in semiconductor fabrication plants is a critical issue facing the microelectronics industry. Considering the large volume of wastewater and a highly variable concentration of these conta
Autor:
Emily Orenstein, Reyes Sierra-Alvarez, Farhang Shadman, Jim A. Field, Chao Zeng, Adrian Gonzalez-Alvarez
Publikováno v:
Ecotoxicology and Environmental Safety. 140:30-36
III-V materials such as indium arsenide (InAs) and gallium arsenide (GaAs) are increasingly used in electronic and photovoltaic devices. The extensive application of these materials may lead to release of III-V ionic species during semiconductor manu
Autor:
Xi Chen, Mona Nagel, Anfal Alobeidli, Petrie Yam, Sharyl Maraviov, Claudio I. Zanelli, Farhang Shadman, Manish Keswani, Mingrui Zhao
Publikováno v:
MRS Advances. 1:2255-2260
Surfactants are commonly used as additives in cleaning formulations during acoustic cleaning of semiconductor surfaces. Since surfactants are surface active, they can affect cavitation characteristics and, therefore, influence cleaning efficiency and