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Autor:
Bertaud, T., Bermond, C., Blonkowski, S., Vallée, Corentin, Lacrevaz, T., Farcy B. Fléchet, A.
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2012, 2 (3), pp.502-509
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2 (3), pp.502-509
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2012, 2 (3), pp.502-509
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2 (3), pp.502-509
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::11122e3498a86fff195931a6134eab23
https://hal.archives-ouvertes.fr/hal-01025008
https://hal.archives-ouvertes.fr/hal-01025008