Výsledky vyhledávání - "Faramarz Hadian"

The Failure of Sn-Bi-Based Solder Joints Due to Current Stressing

Autor: Faramarz Hadian, Sitaram Panta, Javier Flores, Eric J. Cotts

Publikováno v: Journal of Electronic Materials. 52:751-759

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::527f50b56d4e1aaf4cb7809e0032f9ad
https://doi.org/10.1007/s11664-022-10086-y

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Electromigration in tin-bismuth planar solder joints

Autor: Prabjit Singh, L. Palmer, M. Hamid, T. Wassick, R. F. Aspandiar, B. Franco, H. Fu, Richard Coyle, Faramarz Hadian, V. Vasudevan, A. Allen, K. Howell, K. Murayama, H. Zhang, A. Lifton, M. Ribas, M. Sarangapani, T. Munson, S. Middleton

Publikováno v: 2023 International Conference on Electronics Packaging (ICEP).

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::430421600ddd743bb9a08e3d99e1821d
https://doi.org/10.23919/icep58572.2023.10129714

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The Variation of the Electrical Resistance and Microstructure of SnBi based Solder Joints with Current Stressing

Autor: Faramarz Hadian, Javier Flores, Eric Cotts

Publikováno v: JOM. 74:2139-2147

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::0f6db8d4ed74c1131fa022b6fe43c441
https://doi.org/10.1007/s11837-022-05255-7

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The Effect of Thermal History on the Microstructure of SnAgCu/SnBiAg Mixed Assemblies

Autor: Eric J. Cotts, Randy Owen, Mohammed Genanu, Faramarz Hadian

Publikováno v: Journal of Electronic Materials. 50:209-216

The effects of reflow parameter values on the microstructure of SnAgCu/SnBiAg mixed assemblies were examined. The variation of the volume fraction of the hypoeutectic SnBiAg phase with respect to the peak temperature during reflow, and the initial vo

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1f6f54c612e78ba3d1194f7727b7f5c0
https://doi.org/10.1007/s11664-020-08474-3

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Correlation Between the Growth of Voids and Ni3Sn4 Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C

Autor: Eric J. Cotts, Faramarz Hadian, Harry Schoeller

Publikováno v: Journal of Electronic Materials. 49:226-240

The increased demand for microelectronic devices that function in hotter environments compels the study of Pb-free solders containing solid solution dispersoids (such as Bi and Sb), which are stable at significant concentrations in Sn at temperatures

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::693b29ab9071233a8475cf54b43e5d3f
https://doi.org/10.1007/s11664-019-07727-0

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