Zobrazeno 1 - 2
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pro vyhledávání: '"Fangqi Lai"'
Autor:
Chongnan Peng, Wenhui Zhu, Fangqi Lai, Guoping Zhang, Rong Sun, S. W. Ricky Lee, Songfang Zhao
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. In this paper, the TSV process uses a polymeric liner as insulation material and a buffer for thermo-mechanical stress relaxation. Fourier transfo
Publikováno v:
2013 IEEE 63rd Electronic Components & Technology Conference; 2013, p1-38, 38p