Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Fang Jia'en"'
Autor:
Ling Sun, Jicong Zhao, Peng Yihong, Haiyan Sun, Fang Jia'en, Wenjun Sun, and Honghui Wang, Xiaoyong Miao
Publikováno v:
Progress In Electromagnetics Research M. 71:95-105
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7fb416dbcd79e21468a15eee64f53c5f
https://doi.org/10.2528/pierm18051403
https://doi.org/10.2528/pierm18051403
Publikováno v:
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
In order to analyze the warpage of package products during the process of post-molding, the simulation of a kind of low-profile quad flat (LQFP) was carried out. With the mechanical module in ANSYS workbench, the influence of epoxy molding compounds
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94a18808ff9f04f1747032e750af61dd
https://doi.org/10.1109/icept47577.2019.245145
https://doi.org/10.1109/icept47577.2019.245145