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pro vyhledávání: '"Fang, Hongxia"'
Autor:
Fang, Hongxia
Very deep sub-micron process technologies are leading to increasing defect rates for integrated circuits (ICs) and multi-chip boards. To ensure the quality of test patterns and more effective defect screening, functional tests, delay tests, and n-det
Externí odkaz:
http://hdl.handle.net/10161/3910
Publikováno v:
In Journal of Water Process Engineering May 2024 61
Publikováno v:
In Chemical Engineering Journal 1 April 2024 485
Publikováno v:
In Fuel 15 March 2024 360
Publikováno v:
In Journal of Alloys and Compounds 5 October 2023 958
Publikováno v:
In Environmental Research 15 August 2023 231 Part 1
Akademický článek
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Publikováno v:
In Journal of Cleaner Production September 2023
Publikováno v:
Human and Ecological Risk Assessment: An International Journal. 27:708-723
In this study, profile Soil (0–10, 10–30, 30–60 cm) samples were collected and the content, horizontal and vertical distributions of Cr, Mn, Co, Ni, Cu, Zn, As, Cd, and Pb were analyzed. The result...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::792ac9cc69739e22ab474382dadcf2c4
https://doi.org/10.1080/10807039.2020.1750346
https://doi.org/10.1080/10807039.2020.1750346
Autor:
Qian, Chen1 (AUTHOR) vbsqc@163.com, Fang, Hongxia1 (AUTHOR), Cui, Peng1 (AUTHOR), Cai, Fang1 (AUTHOR), Gao, Xinyu1 (AUTHOR), He, Hualong1 (AUTHOR), Hu, Xiaopo1 (AUTHOR)
Publikováno v:
Journal of Separation Science. Jul2019, Vol. 42 Issue 13, p2289-2297. 9p.