Zobrazeno 1 - 10
of 60
pro vyhledávání: '"Fan-Yi Ouyang"'
Publikováno v:
Journal of Electronic Materials. 50:6575-6583
In electronic packaging technology, intermetallic compounds (IMCs) formed during a reflow process significantly affect the mechanical properties of the devices. In this study, In solder and Ni under-bump metallization (UBM) were chosen to investigate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f998b0f74ca5f36d7e17ecb051e4899
https://doi.org/10.1007/s11664-021-09253-4
https://doi.org/10.1007/s11664-021-09253-4
Publikováno v:
Materials; Volume 15; Issue 22; Pages: 8238
We demonstrate a systematic study optimizing the properties of CoCrFeNi medium entropy alloy (MEA) thin films by tuning the deposition parameters of the pulsed direct current (DC) magnetron sputtering process. The chemical composition and microstruct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3ebbddc8392fe1638b667187e455634b
https://pubmed.ncbi.nlm.nih.gov/36431722
https://pubmed.ncbi.nlm.nih.gov/36431722
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bee10565d978643b81eb9b63f09a84f6
https://doi.org/10.1109/ectc51906.2022.00334
https://doi.org/10.1109/ectc51906.2022.00334
Publikováno v:
Advanced Driver Assistance Systems and Autonomous Vehicles ISBN: 9789811950520
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ec989dcf4ba4a37045607ffb3ac9adb
https://doi.org/10.1007/978-981-19-5053-7_6
https://doi.org/10.1007/978-981-19-5053-7_6
Publikováno v:
Intermetallics. 154:107821
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72d093c8a0e57e7e3bf2e43409fb2396
https://doi.org/10.1016/j.intermet.2023.107821
https://doi.org/10.1016/j.intermet.2023.107821
Autor:
Wan-Hsuan Lin, Fan-Yi Ouyang
Publikováno v:
JOM. 71:3084-3093
Printing technology is one of the promising patterning techniques in flexible electronic devices due to its low cost and large-area patternability. In this study, the electromigration (EM) behavior of printed interconnects composed of silver nanopart
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da50bf7bc5e9c02b1402c6926a4b89ad
https://doi.org/10.1007/s11837-019-03627-0
https://doi.org/10.1007/s11837-019-03627-0
Publikováno v:
Microelectronics Reliability. 97:16-23
Serious Joule heating is expected to bring new reliability challenges in advanced packaging technology and thermomigration of solder joints is regarded as one of critical reliability issues. Recently, Co has been proposed as a candidate for under-bum
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b03de1f03c134ad379838c70f57cab80
https://doi.org/10.1016/j.microrel.2019.03.005
https://doi.org/10.1016/j.microrel.2019.03.005
Publikováno v:
Materials Letters. 236:190-193
The effect of Sn orientation on thermomigration was investigated in Cu/Sn2.3Ag/Ni microbumps with diameter of 20 μm. Results showed that anisotropic diffusion of Cu in Sn grains affected both formation rates and locations of Cu6Sn5 intermetallic com
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38f2034339dd890e36f7dc2837541528
https://doi.org/10.1016/j.matlet.2018.10.112
https://doi.org/10.1016/j.matlet.2018.10.112
Autor:
Jian-Jie Wang, Fan-Yi Ouyang
Publikováno v:
Surface and Coatings Technology. 434:128191
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c6cb25ea4979c74615e081bd6ac628f
https://doi.org/10.1016/j.surfcoat.2022.128191
https://doi.org/10.1016/j.surfcoat.2022.128191
Publikováno v:
Applied Surface Science. 576:151845
This study proposes to use highly (111)-oriented nanotwinned Ag films to achieve metal direct bonding under air atmosphere at bonding temperature of 190/200 oC in 3 min. The as-deposited Ag film exhibits strong (111) surface orientation and high dens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c34760705fdf6a06a7093c8bb0e9ead
https://doi.org/10.1016/j.apsusc.2021.151845
https://doi.org/10.1016/j.apsusc.2021.151845