Zobrazeno 1 - 10
of 312
pro vyhledávání: '"Fan‐Tien Cheng"'
Publikováno v:
Applied Sciences, Vol 10, Iss 18, p 6616 (2020)
The abilities to both monitor and control additive manufacturing (AM) processes in real-time are necessary before the routine production of quality AM parts will be possible. Currently, neither ability exist! The major reason is that AM processes are
Externí odkaz:
https://doaj.org/article/a92350210d114da3b547bf4b8bdcfa4e
Design and Implementation of a Data Exchange Platform for TFT-LCD Virtual Production Control Systems
Publikováno v:
International Journal of Automation and Smart Technology, Vol 2, Iss 2, Pp 83-94 (2012)
To solve the problems of delivery shortages and excess product inventories, the TFT-LCD manufacturers and their suppliers need to share production planning data, such as work in process (WIP) data, shipping demands, shipping plans, just-in-time (JIT)
Externí odkaz:
https://doaj.org/article/8264d7e6c5e24b74adefdb361756bf67
Publikováno v:
IEEE Robotics and Automation Letters. :1-8
Autor:
Jan Wilch, Birgit Vogel-Heuser, Jens Mager, Rostislav Cendelín, Thomas Fett, Yu-Ming Hsieh, Fan-Tien Cheng
Publikováno v:
IEEE Robotics and Automation Letters. :1-8
Publikováno v:
IEEE Transactions on Automation Science and Engineering. 19:1517-1529
Publikováno v:
IEEE Transactions on Automation Science and Engineering. 19:1472-1476
Publikováno v:
IEEE Robotics and Automation Letters. 7:8423-8430
Autor:
Min-Hsiung Hung, Yu-Chuan Lin, Hung-Chang Hsiao, Chao-Chun Chen, Kuan-Chou Lai, Yu-Ming Hsieh, Hao Tieng, Tsung-Han Tsai, Hsien-Cheng Huang, Haw-Ching Yang, Fan-Tien Cheng
Publikováno v:
IEEE Transactions on Automation Science and Engineering. 19:1614-1630
Autor:
Hong-Chuong Tran, Yu-Lung Lo, Haw-Ching Yang, Hung-Chang Hsiao, Fan-Tien Cheng, Tsung-Han Kuo
Publikováno v:
IEEE Transactions on Automation Science and Engineering. :1-12
Autor:
Frank Park, Nukula Viswanadham, Ken Goldberg, Michael Wang, Yu Sun, MengChu Zhou, Bengt Lennartson, Fan-Tien Cheng
Publikováno v:
IEEE Transactions on Automation Science and Engineering. 20:739-740