A high performance 0.13 μm copper BEOL technology with low-k dielectric.

Autor: Goldblatt, R.D., Agarwala, B., Anand, M.B., Barth, E.P., Biery, G.A., Chen, Z.G., Cohen, S., Connolly, J.B., Cowley, A., Dalton, T., Das, S.K., Davis, C.R., Deutsch, A., DeWan, C., Edelstein, D.C., Emmi, P.A., Faltermeier, C.G., Fitzsimmons, J.A., Hedrick, J., Heidenreich, J.E.

Publikováno v: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407); 2000, p261-263, 3p