Thermal Characterization of Cloud Workloads on a Power-Efficient Server-on-Chip

Autor: Milojevic, D., Idgunji, S., Jevdjic, D., Ozer, E., Lotfi-Kamran, P., Panteli, Andreas, Prodromou, Andreas, Nicopoulos, Chrysostomos A., Hardy, D., Falsari, B., Sazeides, Yiannakis

Publikováno v: Proceedings-IEEE International Conference on Computer Design: VLSI in Computers and Processors
ICCD
2012 IEEE 30th International Conference on Computer Design, ICCD 2012

We propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters. The integration of 3D-stacked Wide I/O DRAM on top of a logic die increases available memory bandwidth by using dense

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ffeccd18dffd138ce7afd12e51143c4d
https://infoscience.epfl.ch/record/183748