Compact, high-temperature, single-level power modules for 10 to 25 kV DC link voltages using silicon carbide power electronics.

Autor: O'Neal, Chad B., Cole, Zach, Stabach, Jennifer, Falling, Greg, Killeen, Peter, Passmore, Brandon

Publikováno v: 2015 IEEE International Conference on Communication Software & Networks (ICCSN); 2015, p127-130, 4p