Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Fabrice Pires"'
Publikováno v:
Microelectronic Engineering. 33:335-342
The stability of PECVD fluorosilicate glass (FSG) layers deposited with a TEOS/O2/C2F6 chemistry was investigated. The FSG water absorption was found to increase with the fluorine concentration. At a fluorine content above 4 at.%, the fluorine seems
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a328da86fc36a1eb91f0790c1098d875
https://doi.org/10.1016/s0167-9317(96)00062-7
https://doi.org/10.1016/s0167-9317(96)00062-7
Autor:
Et Henri Sentenac-roumanou, Claude Charvy, Sylvette Briand, Claude Lion, Gilbert Magnaud, Fabrice Pires, Gérard Delmas, Mir Hedayatullah
Publikováno v:
Phosphorus, Sulfur, and Silicon and the Related Elements. 118:89-94
H3PO5, monoperoxyphosphoric acid easily prepared by the reaction of H2O2 with P2O5 in acetonitrile, is a very good decontamination agent. The destruction of toxic sulfur and phosphorus agents is completly achieved in very short time.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d780bc28b0ca7784fd83f0889bc16c26
https://doi.org/10.1080/10426509608038802
https://doi.org/10.1080/10426509608038802
Autor:
Jean-Luc Mermet, Marie-José Mouche, Emmanuel Richard, Joaquin Torres, Jean Palleau, Fabrice Pires, François Braud
Publikováno v:
Applied Surface Science. 91:129-133
An optimisation of copper CVD was carried out through the use of screening and modeling experimental designs. The copper precursor [Cu(hfac)tmvs] was delivered through a bubbler using hydrogen as carrier gas. Water vapour was used as reactant. Films
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54fb7b82d36af3eb0e92383693a1afa3
https://doi.org/10.1016/0169-4332(95)00107-7
https://doi.org/10.1016/0169-4332(95)00107-7
Publikováno v:
Journal of Electronic Packaging
Journal of Electronic Packaging, American Society of Mechanical Engineers, 2011, 133 (3), ⟨10.1115/1.4004830⟩
Journal of Electronic Packaging, 2011, 133 (3), ⟨10.1115/1.4004830⟩
Journal of Electronic Packaging, American Society of Mechanical Engineers, 2011, 133 (3), ⟨10.1115/1.4004830⟩
Journal of Electronic Packaging, 2011, 133 (3), ⟨10.1115/1.4004830⟩
Latest electronic component package types are pushing the need to more efficiently remove the dissipated heat using optimized thermal paths going through the printed circuit board (PCB) to reach PCB inner thermal planes. So, to optimize board cooling
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f959d2ba4ad3571a0fe4f04103f5537b
https://hal.archives-ouvertes.fr/hal-01699367
https://hal.archives-ouvertes.fr/hal-01699367
Autor:
Mir Hedayatullah, Omar Abou-Teim, Vincent Soubeyran, Fabrice Pires, Claude Charvy, Claude Lion
Publikováno v:
Phosphorus, Sulfur, and Silicon and the Related Elements. 113:307-309
Magnesium monoperoxyphthalate (MMPP) reacts rapidly with diazinon [(0,0-diethyl-0-(2-isopropyl-4-methyl-6-pyrimidyl)phosphorothioate] under mild conditions leading 2-isopropyl-6-methylpyrimidol as well as 0,0-diethylphosphorothioic and phosphoric aci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53b0d52ecc56ad41456085a7157c53af
https://doi.org/10.1080/10426509608046404
https://doi.org/10.1080/10426509608046404