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pro vyhledávání: '"Fabricante Joel"'
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
IC Package moldings are getting complex and now cater to high performance and non-standard design configurations with technology advancements. Also increasing yield requirements to reduce molding costs of transfer molded packages necessitate optimal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::355cd9cd2c9a964f7da0cb61475dc0b1
https://doi.org/10.1109/eptc.2018.8654350
https://doi.org/10.1109/eptc.2018.8654350
