Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Fabian Michalik"'
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Improving adhesion between copper and lamination resin is one of the biggest challenges in micro-electronic manufacturing, such as IC substrate. Bonding enhancement process by surface roughening is predominant use method, due to providing the highest
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebd5638512e333645403c9507a8bfe1e
https://doi.org/10.1109/ectc32696.2021.00042
https://doi.org/10.1109/ectc32696.2021.00042
Autor:
Thomas Thomas, Andry Liong, Thomas Huelsmann, Tatjana Koenigsmann, Patrick Brooks, W. Cho, Fabian Michalik, Neal Wood, Carrick Chan
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
This work demonstrates the development of surface treatment systems of copper which can meet all of the challenges of mobile electronic devices manufacturing for high frequency function. These challenges are low signal loss and enhanced functional pe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3cd6cad21bdda7adf36c055991b03b20
https://doi.org/10.1109/impact50485.2020.9268557
https://doi.org/10.1109/impact50485.2020.9268557
Autor:
Thomas Huelsmann, Josef Gaida, Thomas Thomas, Patrick Brooks, Yuan Zou, Barbara Geibel, Ken Kim, Belen Gil-Ibanez, Felix Tang, Fabian Michalik
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Follow the development of electronic manufacturing for future microelectronics application where cleanliness of the process is becoming substantial concern, a new oxide replacement process is developed. This work demonstrates a newly developed oxide
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5169826c07cce041181bf94f403aaa7
https://doi.org/10.1109/impact50485.2020.9268580
https://doi.org/10.1109/impact50485.2020.9268580
Autor:
Michael Merschky, Fabian Michalik, Robin Taylor, Martin Thoms, Diego Reinoso-Cocina, Patrick Brooks, Stephan Hotz
Publikováno v:
International Symposium on Microelectronics. 2017:000458-000463
With the trends towards miniaturization and heterogeneous integration, both IC and advanced substrate manufacturers are striving to meet the needs of next generation platforms, to increase the density of interconnects, and generate conductors featuri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bc996f01929287bda3d3188539a2740
https://doi.org/10.4071/isom-2017-wp51_084
https://doi.org/10.4071/isom-2017-wp51_084
Autor:
Catherine Henry de Villeneuve, Fabian Michalik, J.-N. Chazalviel, Karola Rück-Braun, Philippe Allongue
Publikováno v:
Advanced Materials
Advanced Materials, Wiley-VCH Verlag, 2013, 25 (3), pp.416-421. ⟨10.1002/adma.201201546⟩
Advanced Materials, Wiley-VCH Verlag, 2013, 25 (3), pp.416-421. ⟨10.1002/adma.201201546⟩
Creating photoactive monolayers of photochromes is of considerable technological interest. This paper describes the construct of fulgimide monolayers on silicon surfaces and presents a quantitative IR analysis studies of their composition and switchi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::97f631c65633a458274195518f3d4984
https://doi.org/10.1002/adma.201201546
https://doi.org/10.1002/adma.201201546
Autor:
Steffen Dietrich, Christine Schulz, Sebastian Zarwell, Paul Dietrich, Fabian Michalik, Karola Rück-Braun
Publikováno v:
European Journal of Organic Chemistry. 2009:2088-2095
We report the preparation, through palladium-catalyzed transformations, of the indolylfulgimide linker conjugate 1, containing an adamantane core and nitrile anchoring groups. The ethynylene-linker 12 for the final Sonogashira coupling was prepared t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f12b848708c7a2aac3cea1f9a0dd20df
https://doi.org/10.1002/ejoc.200801199
https://doi.org/10.1002/ejoc.200801199
Autor:
M. Kloppisch, R. Haidar, N. Luetzow, Fabian Michalik, Thomas Huelsmann, Gabriela Schmidt, Patrick Brooks
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
With the trend towards miniaturization IC-manufacturers are permanently requested to increase the density of interconnects generating conductors featuring finer lines and spaces. Advanced manufacturing technologies such as Semi-Additive-Processing (S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7f62b131e74d2654dd62c4b457fc6f9
https://doi.org/10.1109/impact.2015.7365190
https://doi.org/10.1109/impact.2015.7365190
Publikováno v:
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
The technological development of new gadgets is a competitive race that consists of a continuous striving for additional features, higher performance and cost minimization. These needs drive the permanent requirement for new and revolutionary develop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6dd65b936b3e73df6bdb4876c5d6fd5
https://doi.org/10.1109/impact.2013.6706633
https://doi.org/10.1109/impact.2013.6706633
Publikováno v:
ChemInform. 43
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95e5712dbabcfd094e5569541374490c
https://doi.org/10.1002/chin.201239261
https://doi.org/10.1002/chin.201239261
