Zobrazeno 1 - 10
of 124
pro vyhledávání: '"Fa Xing Che"'
Publikováno v:
MRS Communications. 11:917-923
The dynamic deformation of thin-film stacked structures in the bond pad of microelectronic devices usually occurs when the contact load rapidly increases during the wire-bonding process. This work developed dynamic strain rate model for analyzing the
Autor:
Koustav Sinha, Christopher Glancey, Wren Chen, Pluck Yang, Ling Pan, Fa Xing Che, Yeow Chon Ong, Hong Wan Ng
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Autor:
Wren Chen, Pluck Yang, Koustav Sinha, Christopher Glancey, Ling Pan, Fa Xing Che, Yeow Chon Ong
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Autor:
Fa Xing Che, Yeow Chon Ong, Hong Wan Ng, Ling Pan, Christopher Glancey, Koustav Sinha, Richard Fan
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:304-313
In this study, fan-out panel-level packaging (FO-PLP) technology using a redistribution layer (RDL) first approach is demonstrated using a large glass panel as a carrier (550 mm $\times650$ mm size). Finite-element analysis (FEA) is conducted to inve
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:786-796
The fan-out interposer (FOI) technology with fine pitch is demonstrated and presented for heterogeneous integration as a cost-effective and enabling technology. The co-design modeling methodology is established for the FOI technology, including wafer
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
Package strength becomes challenging and issue for thin package used in mobile application. Package with low strength may result in package failure such as inside die cracking or package cracking through epoxy mold compound (EMC) when package is subj