Zobrazeno 1 - 10
of 16
pro vyhledávání: '"FLYNN, CARSON"'
Publikováno v:
Journal of Sorority & Fraternity Life Research & Practice; 2023, Vol. 18 Issue 2, p1-20, 20p
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001220-001249
In the last decade, people have seen tremendous increasing of data transmission speed and data storage capacity, which is mainly attributed to the Moore's law. However, this has little to do with RF devices and RF packages that are often used in the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d9331da538a730e3dec3c37d2f78901
https://doi.org/10.4071/2011dpc-keynote4_statschippac
https://doi.org/10.4071/2011dpc-keynote4_statschippac
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2010:1-18
Microelectronics packaging is driven by the continuous increase in demands for smaller, faster, and cheaper products with enhanced performances. Flip-chip technology and multichip packaging are developed to meet the market needs. In recent years, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::adae699090abf49174306303afcdaf24
https://doi.org/10.4071/2010dpc-wa11
https://doi.org/10.4071/2010dpc-wa11
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2010:1-20
IPD technology was originally developed as a way to replace bulky discrete passive components, but it¡¯s now gaining popularity in ESD/EMI protection applications, as well as in RF, high-brightness LED silicon sub-mounts, and digital and mixed-sign
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6208457aaf404b5964f3eb8b8a3704b3
https://doi.org/10.4071/2010dpc-wp31
https://doi.org/10.4071/2010dpc-wp31
Publikováno v:
Proceedings of the IEEE. 97:31-42
The need to integrate more device technology in a given board space for handheld applications such as mobile phones has driven the adoption of innovative packages which stack such devices in the vertical or third dimension (3D). Stacking of device ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::863a390cd16efffb29ed1c69086e7803
https://doi.org/10.1109/jproc.2008.2007460
https://doi.org/10.1109/jproc.2008.2007460
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
The skyrocketing price of gold has driven the rapid adoption of copper wire in semiconductor packaging. Cu wire is being used for increasingly advanced applications requiring copper wire bond to finer bond pad geometries and structures. Palladium coa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdacf54619dec2af0eaab1393352c5e2
https://doi.org/10.1109/ectc.2012.6249104
https://doi.org/10.1109/ectc.2012.6249104
Autor:
Pandi C. Marimuthu, Seung Wook Yoon, Flynn Carson, Shariff Dzafir, Kazuo Ishibashi, Meenakshi Prashant
Publikováno v:
2010 IEEE CPMT Symposium Japan.
Package on Package (PoP) has emerged as the preferred method to stack logic processor and memory in more advanced mobile phone platforms. One issue with the PoP is that the overall height of the stacked package is thicker than other packages in the d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::43f820c7d7d0f6a2d4b8fcabc184dea1
https://doi.org/10.1109/cpmtsympj.2010.5679652
https://doi.org/10.1109/cpmtsympj.2010.5679652
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Demand for Wafer Level Package (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. WLP is the upcoming future packaging techno
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::074213e9484741c622cefcae207586d5
https://doi.org/10.1109/ectc.2010.5490832
https://doi.org/10.1109/ectc.2010.5490832
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
Demand for wafer level packaging (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. There are some restrictions in possible a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2add5a1cef9647c4e4144072a25529b4
https://doi.org/10.1109/eptc.2009.5416412
https://doi.org/10.1109/eptc.2009.5416412
Publikováno v:
3DIC
Demand for Through Silicon Via (TSV) is being driven by the need for 3D stacking to shorten interconnection length, increase signal speed, reduce power consumption and reduce power dissipation. Increasing demand for new and more advanced electronic p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d56d9ff3dcfc8b1eff8b228b08e91468
https://doi.org/10.1109/3dic.2009.5306535
https://doi.org/10.1109/3dic.2009.5306535