Zobrazeno 1 - 10
of 53
pro vyhledávání: '"F.J. Schmuckle"'
Autor:
Viktor Krozer, Ralf Doerner, Maruf Hossain, Nils Weimann, Wolfgang Heinrich, Siddhartha Sinha, F.J. Schmuckle
Publikováno v:
IEEE Journal of Microwaves, Vol 1, Iss 1, Pp 364-373 (2021)
Connecting chips within a module is a basic requirement in transforming MMIC performance to system functionality. More and more applications demand for operation at high mm-wave frequencies or with ultra-large bandwidth. While semiconductor devices h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e8de4e4ec195b2fbf82334bc00ccd7cb
Autor:
Viktor Krozer, Wolfgang Heinrich, Nils Weimann, Sirinpa Monayakul, F.J. Schmuckle, S. Sinha, Michael Hrobak, Ralf Doerner
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 65:1215-1225
This paper presents the design and characterization of a broadband transition in the range dc to 500 GHz using the flip-chip concept. The extremely wideband performance is attained by optimizations in both process technology and electromagnetic desig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1c4d87a427a0d4c2465b17808d866c6d
https://doi.org/10.1109/tmtt.2016.2638429
https://doi.org/10.1109/tmtt.2016.2638429
Autor:
Sirinpa Monayakul, Michael Hrobak, Ralf Doerner, S. Sinha, Olaf Krüger, Nils Weimann, Viktor Krozer, B. Janke, Wilfred John, D. Stoppel, F.J. Schmuckle, Wolfgang Heinrich
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:494-501
We developed a chip mounting technology suitable for low-cost assemblies in the 300–500-GHz frequency range, compatible with standard chip and submount fabrication techniques. The waveguide and transition designs are compatible with indium phosphid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::49ffcded72ab0a4bd3a4ed5b2a8344d3
https://doi.org/10.1109/tcpmt.2016.2636444
https://doi.org/10.1109/tcpmt.2016.2636444
Publikováno v:
2019 12th German Microwave Conference (GeMiC).
With increasing demand for miniaturization the requirements for packaging and system integration are more challenging especially when more and more components are to be integrated into a compact module. In such a situation, crosstalk effects and sign
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d346a40ca79b7ff5a5d23cc44053084
https://doi.org/10.23919/gemic.2019.8698163
https://doi.org/10.23919/gemic.2019.8698163
Autor:
Ksenia Nosaeva, Viktor Krozer, B. Janke, Olaf Krüger, Matthias Rudolph, Thualfiqar Al-Sawaf, Nils Weimann, Dimitri Stoppel, W. Heinrich, Wilfred John, F.J. Schmuckle
Publikováno v:
IEEE Transactions on Electron Devices. 63:1846-1852
The RF power output of scaled subterahertz and terahertz indium phosphide double-heterostructure bipolar transistors (InP DHBTs) is limited by the thermal device resistance, which increases with the geometrical frequency scaling of these devices. We
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c6ebe85061f6fd5ddb92f21a16a84298
https://doi.org/10.1109/ted.2016.2533669
https://doi.org/10.1109/ted.2016.2533669
Publikováno v:
2018 48th European Microwave Conference (EuMC).
On-wafer measurements at microwave and mmwave frequencies require reliable calibration processes to deduct unwanted effects such as the impact of probe, the wafer environment, and the instrumentation equipment itself. However, with increasing frequen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::963b23581bdf1e1e3468f4537a2079ca
https://doi.org/10.23919/eumc.2018.8541813
https://doi.org/10.23919/eumc.2018.8541813
Publikováno v:
2018 IEEE/MTT-S International Microwave Symposium - IMS.
On-wafer measurements of a Device Under Test (DUT) can yield accurate results only if the properties of the measurement environment are well defined and unwanted effects can be removed from the data. This is commonly achieved through a calibration pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c57cc701d9fb816f35183e237c95e4c8
https://doi.org/10.1109/mwsym.2018.8439837
https://doi.org/10.1109/mwsym.2018.8439837
Publikováno v:
2017 90th ARFTG Microwave Measurement Symposium (ARFTG).
In this paper we report on progress towards establishing traceability for fully calibrated on-wafer measurements of planar devices built in membrane technology. For the first time, we present a comprehensive uncertainty budget for on-wafer S-paramete
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0d9129b144302ee9442eb43a04878c26
https://doi.org/10.1109/arftg.2017.8255874
https://doi.org/10.1109/arftg.2017.8255874
Publikováno v:
2017 47th European Microwave Conference (EuMC).
On-wafer measurements of any Device Under Test (DUT) usually require the application of a calibration algorithm to eliminate unwanted but unavoidable effects due to the probe tip properties, the probe pad, the neighboring structures on the wafer and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b748de7b7b17632df021a8247de5c8b2
https://doi.org/10.23919/eumc.2017.8230974
https://doi.org/10.23919/eumc.2017.8230974
Publikováno v:
2017 89th ARFTG Microwave Measurement Conference (ARFTG).
When using multiline TRL calibrations for correcting on-wafer measurements, the accuracy of the result depends crucially on the consistency of the calibration set. For example, each line standard used in the calibration process must allow unambiguous
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b791cedefc445ef267f5292afd59450
https://doi.org/10.1109/arftg.2017.8000823
https://doi.org/10.1109/arftg.2017.8000823