Unplanned out-of-hospital birth and risk factors of adverse perinatal outcome: findings from a prospective cohort

Autor: Gilles Bagou, Sybille Goddet, Christine Potiron, F. Templier, Philippe Pes, Emmanuel Montassier, François Javaudin, Arnaud Legrand, Valérie Hamel

Publikováno v: Scandinavian Journal of Trauma, Resuscitation and Emergency Medicine, Vol 27, Iss 1, Pp 1-7 (2019)
Scandinavian Journal of Trauma, Resuscitation and Emergency Medicine

Background In France, while most babies are delivered at hospital, emergency medical services (EMS) weekly manage calls for unplanned out-of-hospital births. The objective of our study was to describe neonatal morbidity and mortality, defined as deat

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::941e022700afa8528bbeba7d2aecfefc
http://link.springer.com/article/10.1186/s13049-019-0600-z

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A Room Temperature Flip-Chip Technology for High Pixel Count Micro-Displays and Imaging Arrays

Autor: David Henry, T. Catelain, F. Templier, Alain Gueugnot, S. Bisotto, L. Mathieu, F. Marion, Frédéric Berger

Publikováno v: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

This paper highlights the limits that may be encountered when thermally assembling large chips having substantial mismatches of their thermal expansion coefficient (CTE). First, a theory is proposed that shows the size limitation of "emitting" or "im

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b9d4b9210fc897594ae6d4edb458856e
https://doi.org/10.1109/ectc.2016.39

Mechanical failure analysis of thin film transistor devices on steel and polyimide substrates for flexible display applications

Autor: Yves Leterrier, Piet Bouten, Jan-Anders E. Månson, Albert Pinyol, P.H.M. Timmermans, Damien Gilliéron, F. Templier

Publikováno v: Engineering Fracture Mechanics. 77:660-670

The crack onset strain (COS) of 4-level thin film transistor (TFT) devices on both steel foils and thin polyimide (PI) films was investigated using tensile experiments carried out in situ in an optical microscope. Cracks initiated first within the Si

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b8f91be660ea552620adaf9dac4741be
https://doi.org/10.1016/j.engfracmech.2009.12.016

Mechanical integrity analysis of multilayer insulator coatings on flexible steel substrates

Autor: Jan-Anders E. Månson, J. Plojoux, Yves Leterrier, F. Templier

Publikováno v: Thin Solid Films. 515:6890-6898

The cohesive and adhesive properties, and related critical radius of curvature of thin multilayer insulator coatings on a 152 μm thick flexible steel substrate were investigated using tensile experiments carried out in-situ in an optical microscope.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c5ed85a447ee4c9f9b91a1e54c144ac5
https://doi.org/10.1016/j.tsf.2007.01.050