Zobrazeno 1 - 10
of 59
pro vyhledávání: '"F. Patrick McCluskey"'
Autor:
F. Patrick McCluskey, Clifton Buxbaum, Sudip K. Mazumder, Arif Sarwat, Matt Ursino, Miles C. Russell
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
One of the most important elements for market acceptance of new technologies is ensuring reliability. Nowhere is this truer than in the shift from well characterized fossil fuel technologies to newer renewable and sustainable energy technologies. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0640f19a3b7d701ac8b704135a0882b7
https://doi.org/10.1115/ipack2022-97614
https://doi.org/10.1115/ipack2022-97614
Publikováno v:
2022 IEEE Transportation Electrification Conference & Expo (ITEC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::878f84f97669076b03b6baf866ab54bd
https://doi.org/10.1109/itec53557.2022.9814076
https://doi.org/10.1109/itec53557.2022.9814076
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Additive manufacturing is rapidly revolutionizing the way products are designed and built. Its advantages in terms of mobile manufacturing, mass customization, part reduction, waste reduction, and just-in-time sparing are causing it to be considered
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82fb7e5673879a9533b3140124b1f12a
https://doi.org/10.1115/ipack2021-73367
https://doi.org/10.1115/ipack2021-73367
Autor:
He Yun, Raphael Mandel, Miguel Hinojosa, Sevket U. Yuruker, Clifton Buxbaum, F. Patrick McCluskey
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
There are strong incentives to reduce the size of advanced power electronics, such as high-frequency converters. Reduced system size often lowers parasitic losses, system weight, and system cost. Two items significantly limiting such reductions in si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::daf51247e66313d873ed57f417a4dec2
https://doi.org/10.1109/ectc32696.2021.00328
https://doi.org/10.1109/ectc32696.2021.00328
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Reduction of carbon emissions and energy savings are driving the development of lightweight, high efficiency, electric motor systems containing integrated power electronics. Thermal management is one of the major obstacles in high power density elect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ae0afc651818a32c37f2fb2bd4aee78
https://doi.org/10.1109/itherm45881.2020.9190262
https://doi.org/10.1109/itherm45881.2020.9190262
Autor:
Michael M. Ohadi, Sevket U. Yuruker, F. Patrick McCluskey, Clifton Buxbaum, Shiladri Chakraborty, He Yun, Raphael Mandel, Alireza Khaligh, Miguel Hinojosa, Lauren Boteler, Yongwan Park
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Wide bandgap semiconductors, such as silicon carbide (SiC), have properties that allow them to surpass the performance of conventional silicon (Si) semiconductors in power electronic applications. Placing these wide bandgap devices in 3D-integrated p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8631554c3b6dd1077884a96cd62db0d3
https://doi.org/10.1109/itherm45881.2020.9190490
https://doi.org/10.1109/itherm45881.2020.9190490
Publikováno v:
Microelectronics Reliability. :738-744
Shear testing of wire bonds in microelectronics devices is important in bonding process qualification, but the actual mechanism of shearing Cu bonds from Al pads is not thoroughly understood. In this study, experiments and finite element analysis (FE
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::357f60fda27c4fc3101cc02acf9333ff
https://doi.org/10.1016/j.microrel.2018.06.061
https://doi.org/10.1016/j.microrel.2018.06.061
Publikováno v:
Microelectronics Reliability. :528-533
Most failures of Multilayer Ceramic Capacitors (MLCCs) are mechanical (e.g., cracking) in nature. Therefore, reliability assessment of these parts depends heavily on the available mechanical properties in the literature. As indentation offers advanta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e777afb0f7f901602da477d8a91a950
https://doi.org/10.1016/j.microrel.2018.07.116
https://doi.org/10.1016/j.microrel.2018.07.116
Publikováno v:
Microelectronics Reliability. 87:232-237
Currently, Ag die-attach techniques, using nano-silver particles, are of high interest for manufacturing of wide-band-gap (WBG) power module due to their high-temperature operation capability. However, the high cost of silver and complicated processi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8954550d79aef3497a3f876815ea8a5
https://doi.org/10.1016/j.microrel.2018.06.010
https://doi.org/10.1016/j.microrel.2018.06.010
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2018:000007-000014
Protecting electronic components at harsh environments and applications often requires the use of conformal coatings, underfills or potting compounds. The temperature dependent properties of these materials greatly depend on their chemical formulatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e74de9e20d345ee9839f3a5ab998cf1f
https://doi.org/10.4071/2380-4491-2018-hiten-000007
https://doi.org/10.4071/2380-4491-2018-hiten-000007