Zobrazeno 1 - 10
of 17
pro vyhledávání: '"F. P. McCluskey"'
Publikováno v:
2018 AIAA/IEEE Electric Aircraft Technologies Symposium.
Airplane cooling process can be performed with the help of two different techniques. One is global cooling system and the other is local cooling system. The goal of present paper is to investigate both cooling systems which may be good candidates for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::332172347793e366acf80caa2c70acc5
https://doi.org/10.2514/6.2018-4991
https://doi.org/10.2514/6.2018-4991
Publikováno v:
Microelectronics Reliability. 54:1818-1822
A PoF approach to mitigating infant mortality is proposed which includes (1) conducting reliability capability and product maturity analyses; (2) identifying defects through non-destructive analysis, if possible; and (3) developing electrical tests t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae8aa909930294fd760731a7378a875f
https://doi.org/10.1016/j.microrel.2014.07.090
https://doi.org/10.1016/j.microrel.2014.07.090
Publikováno v:
Microelectronics Reliability. 54:1680-1685
Driven by consumer markets and industrial needs, power electronic systems are operating at higher power densities, in smaller packages and in more exotic environments. As these trends continue, ensuring long-term operation in harsher conditions requi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5247821ceac51b43270b101143011fd8
https://doi.org/10.1016/j.microrel.2014.07.123
https://doi.org/10.1016/j.microrel.2014.07.123
Autor:
F. P. McCluskey
Publikováno v:
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
• Embedded technology is everywhere and reducing in size • One important example is heterogeneous integration including anisotropic or differential cooling • Moving to thermally anisotropic substrate decreases the safe distance between the powe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24a994d568d33453b6f02715c563f4a6
https://doi.org/10.1109/3dpeim.2016.7570555
https://doi.org/10.1109/3dpeim.2016.7570555
Autor:
Pedro O. Quintero, F. P. McCluskey
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 11:531-539
The demand for electronics capable of operating at temperatures above the traditional 125°C limit continues to increase. Devices based on wide bandgap semiconductors have been demonstrated to operate at temperatures up to 500°C, but packaging remai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63b13fdc731d51baf81d199821277fdc
https://doi.org/10.1109/tdmr.2011.2140114
https://doi.org/10.1109/tdmr.2011.2140114
Publikováno v:
Microelectronics Reliability. 46:1910-1914
European RoHS directives, enacted in response to concerns about the toxicity of lead, are driving the substitution of Pb-free solders for Pb-containing solders at the component to board level. While European RoHS regulations currently exempt high Pb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f9c8b3b9bcad91ac355456ec171d6f09
https://doi.org/10.1016/j.microrel.2006.07.090
https://doi.org/10.1016/j.microrel.2006.07.090
Publikováno v:
Microelectronics Reliability. 40:293-306
A physics-of-failure based methodology is presented for determining the remaining life in electronic assemblies. The methodology has three steps. The first step is to conduct an analysis of the degradation in electronic assemblies resulting from thei
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3931eaa8ff34b70d9485622df633e4e3
https://doi.org/10.1016/s0026-2714(99)00082-7
https://doi.org/10.1016/s0026-2714(99)00082-7
Autor:
F. P. McCluskey, A. Bar-Cohen
Publikováno v:
2013 IEEE Transportation Electrification Conference and Expo (ITEC).
Presents the power point presentations from the conference proceedings. Power electronics is the critical enabling technology at the intersection of renewable power generation, reliable power distribution and transmission, and efficient power utiliza
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66caa73e2c43329f6db364f259487274
https://doi.org/10.1109/itec.2013.6573464
https://doi.org/10.1109/itec.2013.6573464
Autor:
F. P. McCluskey, Vibhash Jha
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
This paper investigates the effort to improve the reliability of a power module using physics-of- failure based approach. Thermal simulation of the power module board with the heat sink has been carried out and further these results have been used fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b41e0787239f9699d736afd53539912
https://doi.org/10.1109/itherm.2010.5501280
https://doi.org/10.1109/itherm.2010.5501280
Autor:
Nicholas R. Jankowski, F. P. McCluskey
Publikováno v:
2009 IEEE Pulsed Power Conference.
Steady-state power conversion applications have benefited from numerous packaging and cooling improvements, and there has been a push to apply the same techniques to pulsed power electronic systems and devices. However, the unique aspects of pulsed s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc4dac030ead98dd4d0beed99b823ce5
https://doi.org/10.1109/ppc.2009.5386368
https://doi.org/10.1109/ppc.2009.5386368