Zobrazeno 1 - 10
of 776
pro vyhledávání: '"F. Clive"'
Autor:
Taylor, Bernard
Publikováno v:
Journal of General Management. Spring74, Vol. 1 Issue 3, p3-12. 10p. 1 Black and White Photograph.
Autor:
Derstine, Robert P.
Publikováno v:
The Accounting Review, 1980 Apr 01. 55(2), 353-354.
Externí odkaz:
https://www.jstor.org/stable/246361
Autor:
Ward, Bart H.
Publikováno v:
The Accounting Review, 1977 Jul 01. 52(3), 773-774.
Externí odkaz:
https://www.jstor.org/stable/246105
Autor:
Derstine, Robert P., Burns, Thomas J.
Publikováno v:
Accounting Review. Apr80, Vol. 55 Issue 2, p353. 2p.
Autor:
Champion, F. Clive
Publikováno v:
Proceedings of the Royal Society of London. Series A, Containing Papers of a Mathematical and Physical Character, 1932 Jan 01. 134(825), 672-681.
Externí odkaz:
https://www.jstor.org/stable/95886
Publikováno v:
ProGREss’21.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0bcedc32db5da9de677b27c97a46d99b
https://doi.org/10.3997/2214-4609.202159125
https://doi.org/10.3997/2214-4609.202159125
Publikováno v:
Proceedings.
Kenya’s Shell-BG operated L10 A & B blocks contain the only offshore oil discovery on the East African margin. This discovery is encouraging for oil exploration in the region; however, uncertainty remains over the source of the oil and the extent o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb51a34542b04724c53d38068918bd58
https://doi.org/10.3997/2214-4609.201702403
https://doi.org/10.3997/2214-4609.201702403
Autor:
F. Clive De Paula
Publikováno v:
MAB, Vol 40, Iss 2, Pp 46-65 (1966)
Externí odkaz:
https://doaj.org/article/da722bbd162540b59f18e9f122d1b777
Autor:
F. Clive De Paula
Publikováno v:
MAB, Vol 40, Iss 1, Pp 4-25 (1966)
Externí odkaz:
https://doaj.org/article/934262955047461dac83f030744b7293
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
In recent years, many OSAT (Outsourced Semiconductor Assembly and Test) companies start to explore copper wire bond process, which is believed to be able to reduce the IC packaging cost. Copper wire also shows better electrical performance especially
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2c2471349ba185e4061d088dfdb97bb
https://doi.org/10.1109/eptc.2012.6507163
https://doi.org/10.1109/eptc.2012.6507163