Zobrazeno 1 - 10
of 137
pro vyhledávání: '"F. Cacchione"'
Publikováno v:
Politecnico di Milano-IRIS
Publikováno v:
Meccanica. 43:469-483
In this paper the effects of accidental impacts on polysilicon MEMS sensors are investigated within the framework of a three-scale finite element approach. By allowing for the very small ratio (on the order of 10−4) between the inertia of the MEMS
Publikováno v:
Meccanica. 40:485-503
The issue of mechanical characterization of polysilicon used in micro electro mechanical systems (MEMS) is discussed in this paper. An innovative approach based on a fully on-chip testing procedure is described; two ad hoc designed electrostatically
Autor:
Schaffer, Alina1,2 (AUTHOR) alina_schaffer@eva.mpg.de, Widdig, Anja1,2 (AUTHOR), Holland, Ruben3 (AUTHOR), Amici, Federica4,5 (AUTHOR)
Publikováno v:
Scientific Reports. 6/14/2024, Vol. 14 Issue 1, p1-13. 13p.
Autor:
Yutong Li1
Publikováno v:
Illinois Reading Council Journal. Summer2024, Vol. 52 Issue 3, p3-10. 8p.
Publikováno v:
Advances in Multiphysics Simulation and Experimental Testing of Mems
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5fe2527077e63deaddca56c5fdaaf32
https://doi.org/10.1142/9781860948633_0012
https://doi.org/10.1142/9781860948633_0012
Publikováno v:
Micro and Nano Mechanical Testing of Materials and Devices ISBN: 9780387787008
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6aeca8000989324f0715b24f2081820a
http://hdl.handle.net/11311/551037
http://hdl.handle.net/11311/551037
Publikováno v:
Politecnico di Milano-IRIS
A parametric numerical study aimed at understanding the influence of the average grain size on the mechanical behaviour of polysilicon films was addressed in this paper. A 2D geometrical model of the polycrystal coupled with a finite element (FE) pro
Publikováno v:
Politecnico di Milano-IRIS
The problem of impact rupture in polysilicon MEMS is addressed in this paper employing a numerical 2D geometrical model of the polycristal obtained by means of a Voronoi tessellation coupled with a FE mesh. The intergranular and transgranular rupture
Publikováno v:
Fracture of Nano and Engineering Materials and Structures ISBN: 9781402049712
Scopus-Elsevier
Politecnico di Milano-IRIS
Scopus-Elsevier
Politecnico di Milano-IRIS
The issue of Micro Electro Mechanical Systems (MEMS) mechanical reliability is becoming increasingly important. This implies that sufficiently accurate methodologies to determine the mechanical response of MEMS subject to various loading conditions m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ccccddb86e85f12a47a2361dda304f10
https://doi.org/10.1007/1-4020-4972-2_320
https://doi.org/10.1007/1-4020-4972-2_320