Zobrazeno 1 - 4
of 4
pro vyhledávání: '"F. Askari Farahani"'
Publikováno v:
Journal of Electronic Packaging. 133
In this study, the transient response of electronic assemblies to mechanical loading encountered in drop and shock conditions are investigated with transient finite element methods. Many manufacturers face design challenges when evolving new designs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b63698a3096946f35c9e9e25a532aab
https://doi.org/10.1115/1.4005091
https://doi.org/10.1115/1.4005091
Publikováno v:
Journal of Electronic Packaging. 133
The development of portable electronics poses design challenges when evolving new designs for high strain-rate life cycle loading, such as in drop events, blast events, vibration, ultrasonic process steps, etc. This paper discusses an experimental in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5c1ac3b4561cdf6a73fbaf83a67be00
https://doi.org/10.1115/1.4005090
https://doi.org/10.1115/1.4005090
Publikováno v:
ASME 2009 InterPACK Conference, Volume 1.
The dynamic response of electronic assemblies to drop and shock conditions is investigated through tests and simulation. The portable electronic product tested in this study consists of a circuit card assembly and a battery pack supported in a two-pi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04ce2eba630afc4b6ed7d0d8d09a437b
https://doi.org/10.1115/interpack2009-89179
https://doi.org/10.1115/interpack2009-89179
Conference
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