Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Eyup Can Demir"'
Publikováno v:
Journal of Composite Materials. 57:1087-1104
The stiffness of polymeric materials can be improved dramatically with the addition of nanoparticles. In theory, as the nanoparticle loading in the polymer increases, the nanocomposite becomes stiffer; however, experiments suggest that little or no s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::477d9f600024e911d16dd0a75bedd31c
https://doi.org/10.1177/00219983221149122
https://doi.org/10.1177/00219983221149122
Autor:
Abdelhaq Benkaddour, Eyup Can Demir, Nicole C Jankovic, Chun Il Kim, Mark T McDermott, Cagri Ayranci
Publikováno v:
Journal of Composite Materials. 56:1775-1788
Recent demands for high-performance lightweight materials have brought researchers’ attention to various nanoparticles to reinforce polymeric materials. As such, sustainable and stiff cellulose nanocrystals (CNC) have become a popular candidate as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c308dfd2f826cc1b68477a2675863e0
https://doi.org/10.1177/00219983221075418
https://doi.org/10.1177/00219983221075418
Autor:
Charles-François de Lannoy, Daniel A. Osorio, Victoria Jarvis, Mark T. McDermott, Abdelhaq Benkaddour, Cagri Ayranci, Eyup Can Demir, Emily D. Cranston, Elina Niinivaara, Nicole C. Jankovic
Publikováno v:
ACS Applied Polymer Materials. 3:4673-4684
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1deaddbba9e81db4cb493c7cf604fb3e
https://doi.org/10.1021/acsapm.1c00765
https://doi.org/10.1021/acsapm.1c00765
Autor:
Eyup Can Demir, Abdelhaq Benkaddour, Daniel R Aldrich, Mark T McDermott, Chun Il Kim, Cagri Ayranci
Publikováno v:
Journal of composite materials. 56(10)
Nanocomposite technologies can be significantly enhanced through a careful exploration of the effects of agglomerates on mechanical properties. Existing models are either overly simplified (e.g., neglect agglomeration effects) or often require a sign
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a7945f96e418d8953c80e8d4ae678ab1
https://pubmed.ncbi.nlm.nih.gov/35464628
https://pubmed.ncbi.nlm.nih.gov/35464628
Commonly used severe plastic deformation (SPD) methods are suitable for fabrication of bulk nano and ultrafine-grained metals. Drawbacks of these methods include durability of dies, geometrical restrictions and reduced ductility of the products. In t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::03a8f0e7044cf0010f911dd776b50378
https://hdl.handle.net/11511/42797
https://hdl.handle.net/11511/42797
Fabrication and characterization of gold-tin eutectic bonding for hermetic packaging of MEMS devices
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
This paper presents the fabrication of wafer-level hermetic encapsulation for MEMS devices using low-temperature (300°C) Au-Sn bonding together with their pre- and postbonding characterization. Thermal evaporation method was used for metallization w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16b397c8048c96c5e5d9fc01ca72b9a9
https://doi.org/10.1109/eptc.2014.7028329
https://doi.org/10.1109/eptc.2014.7028329
Publikováno v:
IEEE SENSORS 2014 Proceedings.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d58a61472e05adb000c74b4076b270f
https://doi.org/10.1109/icsens.2014.6985473
https://doi.org/10.1109/icsens.2014.6985473