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pro vyhledávání: '"Everett A. Wenzel"'
Autor:
Stefan P. Domino, Everett A. Wenzel
Publikováno v:
International Journal of Heat and Mass Transfer. 211:124168
Publikováno v:
Proceedings of the Combustion Institute. 38:3277-3285
We present recent results toward the quantification of spray characteristics at engine conditions for an eight-hole counter-bored (stepped) GDI injector – Spray G in the ECN denomination. This computational study is characterized by two novel featu
Autor:
Everett A. Wenzel, Marco Arienti
Publikováno v:
Journal of Computational Physics. 477:111957
Publikováno v:
International Journal of Heat and Mass Transfer. 97:653-661
Asymmetric liquid–liquid droplet heating mechanisms differ from the more commonly studied and better understood symmetric liquid–gas mechanisms. In this work, we simulate two-dimensional low Weber number droplet heating in developing low Reynolds
Publikováno v:
Journal of Thermal Science and Engineering Applications. 10
Flow boiling in an onboard variable microgap is demonstrated as a viable cooling method for multidevice electronics. The microgap is created by a bonded conformal encapsulation that delivers uniform subcooled inlet coolant flow across a multidevice l
Publikováno v:
Journal of Thermal Science and Engineering Applications. 10
Onboard liquid cooling of electronic devices is demonstrated with liquid delivered externally to the point of heat removal through a conformal encapsulation. The encapsulation creates a flat microgap above the integrated circuit (IC) and delivers a u
Autor:
Everett A. Wenzel, Sean C. Garrick
Publikováno v:
Journal of Computational Physics. 397:108835
We present an Eulerian-Lagrangian approach for the modeling and simulation of immiscible multiphase flow systems. The Naiver-Stokes equations are solved on a traditional Eulerian grid while the fluid mass and phase information is discretized by Lagra
Autor:
Everett A. Wenzel, Sean C. Garrick
Publikováno v:
Proceeding of Second Thermal and Fluids Engineering Conference.
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
A new technology for onboard liquid cooling of high power density electronic devices is introduced via conformal encapsulation of the devices and direct contact liquid cooling. This research effort addresses size, weight and power constraints of onbo