Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Eva Wai Leong Ching"'
Autor:
Hong Cai, Md Hazwani Khairy, Rachel Ang, Linfang Xu, Doris Ng, Nanxi Li, Zhonghua Gu, Anmin Kong, Weiguo Chen, Wen Wei Seit, Eva Wai Leong Ching, Norhanani Jaafar, Huanhuan Wang, Landobasa Y.M. Tobing, Leh Woon Lim, Qingxin Zhang, Lennon Yao Ting Lee
Publikováno v:
Silicon Photonics XVIII.
Autor:
Surya Bhattacharya, David Ho Soon Wee, Eva Wai Leong Ching, Lim Teck Guan, Jong Ming Ching, Loh Woon Leng
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
A FOWLP and a Si-Interposer integration platform for Electronic IC (EIC) and Photonic IC (PIC) are described here. These two platforms are capable to support high-speed integration and scalable design of the next generation Optical Engine. The integr
Autor:
Jaibir Sharma, Olivier Vancauwenberghe, Guoqiang Wu, Eldwin J. Ng, Didier Pohl, Eva Wai Leong Ching
Publikováno v:
2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS).
Passive SAW sensors do not require circuitry or power and are ideal for harsh environments or rotating machinery. AlN-based thin film SAW resonators for temperature and pressure sensors have been developed in this work using AlGe wafer-scale encapsul
Autor:
Simon Lim Siak Boon, Tai Chong Chai, Sharon Lim Pei Siang, Ser Choong Chong, Eva Wai Leong Ching
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Mobile application or appliance demands multi-functions, high speed, light or small form factor and low cost. One of the common approaches to meet all these requirement is put one package over another package. This approach is commonly known as Packa
Autor:
Lim Soon Thor, Eva Wai Leong Ching, Ong Jun Rong, Jong Ming Chinq, Alagappan Gandhi, Phua Wee Kee, Png Ching Eng, Thomas Y. L. Ang, Lim Teck Guan, Li Hong Yu
Publikováno v:
Asia Communications and Photonics Conference/International Conference on Information Photonics and Optical Communications 2020 (ACP/IPOC).
A Silicon Optical Interposer for 2.5D integration of high speed electrical and optical circuit is proposed here. The Si Interposer functions as a Base Substrate for optical alignment of the Photonic IC and the fibers which are held in a Si Fiber Bloc
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
With the increasing demand of compact and high power rated power module in the EV / HEV (Electric Vehicle / Hybrid Electric Vehicle) industry, packaging of power module is getting more challenging. The push for intelligent power modules in the dynami
Autor:
Eva Wai Leong Ching, Ong Jun Rong, Li Hong Yu, Chong Ser Choong, Thomas Y. L Ang, Jong Ming Chinq, Lim Soon Thor, Lim Teck Guan
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
A Silicon Optical Interposer for 2.5D integration of high speed electrical and optical circuit is proposed here. The Si Interposer functions as a base substrate for the optical alignment of the Photonic IC and the fibers which are held in a Si Fiber
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Fan-out Wafer Level Packaging (FOWLP) is a versatile semiconductor packaging technology which can be used for various RF and Digital applications. In the FOWLP technology, the bare die IC is embedded in a molding compound for protection, and a Redist
Autor:
Earl Gow, Kangho Lee, Lim Wei Yi, Ta-Chien Cheng, Eva Wai Leong Ching, Lim Teck Guan, Jason Janesky
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
A magnetic shield was developed for the standard BGA MRAM DDRS chip to increase the magnetic interference tolerance from 100}}oe to more than 500 oetextbf{{. This enabled the low power and fast speed MRAM devices to operate in more rugged conditions.
Autor:
Boo Yang Jung, Lim Wei Yi, Danny Pak-Chum Shum, Lim Teck Guan, Juan Boon Tan, Yi Wanbing, Bharat Bhushan, Francis Poh, Eva Wai Leong Ching
Publikováno v:
2018 IEEE International Memory Workshop (IMW).
We present the first magnetic shielding study including design, modeling, fabrication and characterization of package level magnetic shield for perpendicular spin-transfer torque magneto resistive random-access memory (STT-MRAM). Magnetic shielding i