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Autor:
KiYeul Yang, JunHwan Park, WonChul Do, SangHyoun Lee, JinKun Yoo, SeokHun Yun, JinYoung Khim, MinJae Yi, JiHun Yi, EunTaek Jeong, SeungNam Son, DongHyun Khim
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Fan-Out Wafer-Level Interposer Package-on-Package (PoP) design has many advantages for mobile applications such as low power consumption, short signal path, small form factor and heterogeneous integration for multi-functions. In addition, it can be a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01d59997863dce00dbc4dfd32048e8b2
https://doi.org/10.1109/ectc32862.2020.00298
https://doi.org/10.1109/ectc32862.2020.00298
