Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Eun-Chul Ahn"'
Autor:
Han-Gyu Kim, Su-Nam Kim, Eun-Chul Ahn, Jeong-Geun Moon, Chan-Woong Park, Hyung-Do Lee, Hwa-Dong Oh, Hyo-Sang Jang, Pyo-Jin Kim, Seung-Je Hong, Byeong-Hwa Kang
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
The miniaturization trend in the contemporary electronics market continuously demands for printed circuit boards (PCBs) that are thinner and can house more electronic components, which makes manufacturing of PCBs of high reliability more challenging.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54ce2b9d69777d473513da3e1582c9da
https://doi.org/10.1109/eptc50525.2020.9315143
https://doi.org/10.1109/eptc50525.2020.9315143
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
This paper presents that built-in stress of copper, FRP and solder-resist (SR) layers is critical to predict an IC package substrate's warpage at room temperature. The built-in stresses are 78MPa on copper, 16MPa on FR4 and 9MPa on SR through simple
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d35055a0eba3694e08c594eaaf05e231
https://doi.org/10.1109/eptc50525.2020.9315057
https://doi.org/10.1109/eptc50525.2020.9315057
Autor:
Kyung-Yoon Park, Jae-Young Ahn, Jeong-Geun Moon, Jung-Yul Kim, Sun-Yong Lee, Eun-Chul Ahn, Young-Seok Kim, Kwang-Seop Youm, Oh-Gul Kwon, Jee-Won Jeong
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
Recent developments in electronics have led to the pursuit of highly efficient technologies that reduce resistance and minimize signal loss rates. While Direct Au Surface Treatment in PKG Substrate is one of the ways to minimize signal loss rates, Di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42f31d7b77668fdfb2c5f8647a48f675
https://doi.org/10.1109/eptc50525.2020.9315136
https://doi.org/10.1109/eptc50525.2020.9315136
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Recently, 5G and AI are driving the electronic devices to require high-performance computing and high-speed transmission. To support emergence of high speed 5G smartphone in mobile sector, the number of components is trending significantly upward. Te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0608694f66e96ee6a35d3298ff85719b
https://doi.org/10.1109/ectc32862.2020.00297
https://doi.org/10.1109/ectc32862.2020.00297
Autor:
YoungHwan Shin, ShinKi Lee, DongSu Lee, ChangWon Ma, HunJung Lim, WooYong Jung, Eun-Chul Ahn, HanSung Lee, InSeok Hwang, SangWook Han, DaeShin Lee, YounHo Jung
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
With the recent emergence of AI and 5G, semiconductor packaging requires higher level of integration and ultra-fine technology. In the server and data center fields, trends are increasing number of I/O and package size. Advancements in autonomous veh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52d2e80e743ae082c17a5a6944c4005f
https://doi.org/10.1109/eptc47984.2019.9026708
https://doi.org/10.1109/eptc47984.2019.9026708
Autor:
Jong-Young Park, Eun-Chul Ahn, Young-Jae Kim, Joo-Hyoung Noh, Young-Hwan Shin, Kwang-Seop Youm, Kwan-Sun Yoon
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
The semiconductor industry's push toward continued miniaturization and increasing complexity is driving wider adoption of advanced package technology. Advanced package provides potential solution for systems with better performance and more functions
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a613ace15ebb69b005c9c7e12ff2b514
https://doi.org/10.1109/eptc47984.2019.9026634
https://doi.org/10.1109/eptc47984.2019.9026634
Autor:
Moon Gi Cho, Eun-Chul Ahn, Jinho Choi, Yong-hwan Kwon, Hwan Sik Lim, Sun-Hee Park, Jae-Sik Chung
Publikováno v:
International Symposium on Microelectronics. 2012:000906-000911
In order to minimize the large plate growth of Ag3Sn intermetallic compounds (IMCs) adversely affecting the mechanical behavior and reducing the reliability of solder joints, the Ag content of less than 3wt% has been suggested in ball grid array (BGA
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96afce98de71073d79f6fb19087af5af
https://doi.org/10.4071/isom-2012-wp42
https://doi.org/10.4071/isom-2012-wp42
Autor:
Young-Hee Song, Hyung-Kil Baek, Jongho Lee, Cheul-Joong Youn, Eun-Chul Ahn, Tae-Gyeong Chung, Young-Lyong Kim
Publikováno v:
2008 IEEE 9th VLSI Packaging Workshop of Japan.
The recent requirements for achieving higher memory density in a smaller package size have adopted 3D packaging of thin dies in a single package. However, increasing the number of dies in 3D stacking is limited by increasing the cost due to decrease
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::260d2e0cf39491b04ebce78483a8652f
https://doi.org/10.1109/vpwj.2008.4762205
https://doi.org/10.1109/vpwj.2008.4762205
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
Thermal cycling (TC) and drop test results of electronic package are presented in this paper, which have been known as the main reliability test items in electronics. Especially, as the movement of personal computer to handhelds accelerates, this pap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::030ed36905cf65ef6cd00a62faf34aa6
https://doi.org/10.1109/ectc.2007.373830
https://doi.org/10.1109/ectc.2007.373830
Autor:
Tae-Gyeong Chung, Hyeon Hwang, Teak-Hoon Lee, Jianhua Li, Myeongkee Chung, Qiang Chen, Pyoung-Wan Kim, Eun-Chul Ahn
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
Current mechanical wafer dicing process adopting diamond grit shows advantages of low cost and high productivity. However, mechanical process for ultra-thin wafers would induce residual stress or mechanical damage, which can lead to wafer broken and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::247f5fe3fbe8ab171dcc9e708d3a5515
https://doi.org/10.1109/ectc.2007.373883
https://doi.org/10.1109/ectc.2007.373883