Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Eun Sook Sohn"'
Autor:
MinKeon Lee, Dave Hiner, WonChul Do, Michael G. Kelly, GamHan Yong, MinSu Jeong, JiHun Lee, JinYoung Khim, JongHyun Jeon, Eun-Sook Sohn, DongHoon Han
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Semiconductor products used in high-performance computing (HPC) and artificial intelligence (AI) applications require higher memory bandwidth, greater input/output (I/O) count, better power delivery network (PDN) performance and improved heat dissipa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::179d2de13ea86592d2abd3c438a28051
https://doi.org/10.1109/ectc32696.2021.00027
https://doi.org/10.1109/ectc32696.2021.00027
Publikováno v:
Nanoscience and Nanotechnology Letters. 9:1139-1145
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bcc9c8e4b02f98e872cef83c7d6e765a
https://doi.org/10.1166/nnl.2017.2473
https://doi.org/10.1166/nnl.2017.2473
Autor:
Jin Young Kim, Choonheung Lee, Cha Gyu Song, Sung-Hoon Choa, Eun-Sook Sohn, Hoon Sun Jung, Juhoon Yoon, DaeByoung Kang
Publikováno v:
Nanoscience and Nanotechnology Letters. 8:1-7
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7f951019472b2cebb303bdbfc6a4e66
https://doi.org/10.1166/nnl.2016.2095
https://doi.org/10.1166/nnl.2016.2095
Autor:
Ahmer Syed, Chang Gyun Ryu, TaeSeong Kim, Eun Sook Sohn, Se Woong Cha, J. Scanlan, Won Joon Kang
Publikováno v:
2008 58th Electronic Components and Technology Conference.
This paper presents a collection of test data showing how the choice of package design and material can have a different effect on performance depending on the loading conditions. Board level temperature cycling, drop (JESD22-B111), and cyclic bend (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42bfa5f067ed2cd79de057ac25daa533
https://doi.org/10.1109/ectc.2008.4550168
https://doi.org/10.1109/ectc.2008.4550168
Publikováno v:
2008 58th Electronic Components and Technology Conference.
The molded underfill (MUF) process has a lot of advantages compared with capillary underfill process in view of reduction of process, cycle time of process, material and equipment cost since this application utilizes the conventional mold materials a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4e9c6a306675c53e7a0831e9de36894
https://doi.org/10.1109/ectc.2008.4550000
https://doi.org/10.1109/ectc.2008.4550000
Autor:
Won Joon Kang, Tae Kyung Hwang, Chan Ha Hwang, JoonYeob Lee, Eun Sook Sohn, Se Woong Cha, Choon Heung Lee
Publikováno v:
2007 International Conference on Electronic Materials and Packaging.
In spite of a great success of stacked package (PoP) in the market, some reliability issues about package on package (PoP) have been raised by several customers. To guarantee a high reliability in board level performances, many process and material d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e41169408aec88282f8eb47e6736efb
https://doi.org/10.1109/emap.2007.4510333
https://doi.org/10.1109/emap.2007.4510333
Autor:
Ji Young Chung, Eun-Sook Sohn, Tae-Kyung Hwang, Mahmoud Dreiza, JoonYeob Lee, Jin Young Kim, Min Yoo
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
In spite of a great success of stacked package (PoP) in the market, some reliability issues have been raised. One of them is a board level reliability evaluation of PoP with 2nd level underfill. Some customers have issued the application of 2nd level
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5b1ca280c5040bee5a2655267e0ba57
https://doi.org/10.1109/ectc.2007.374059
https://doi.org/10.1109/ectc.2007.374059
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
Recent data [Syed, A., et al., "Alloying Effect of Ni, Co, and Sb in SAC solder for Improved Drop Performance of Chip Scale Packages with Cu OSP Pad Finish," Proceedings of the 8th EPTC conference, 2006, pp. 404-411.] shows that significant improveme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d9700b2bff49ae03394216e77a2dd09
https://doi.org/10.1109/ectc.2007.373845
https://doi.org/10.1109/ectc.2007.373845
Autor:
Ahmer Syed, Choonheung Lee, Sung-Su Park, Akito Yoshida, WonJoon Kang, Jaedong Kim, Jin Young Kim, Eun-Sook Sohn, Yong Joon Kim, Yoon-Hyun Ka
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
This paper discusses the optimal design for PS-etCSP to achieve reliable thermal fatigue life of solder joint. For this purpose design analysis was performed using both simulation and experimental approaches. Since reduction of warpage is most critic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e86ffc9950ca84f49edcdcdd5e917c9
https://doi.org/10.1109/ectc.2004.1319403
https://doi.org/10.1109/ectc.2004.1319403
Autor:
Syed, A., Scanlan, J., Se Woong Cha, Won Joon Kang, Eun Sook Sohn, Tae Seong Kim, Chang Gyun Ryu
Publikováno v:
2008 58th Electronic Components & Technology Conference; 2008, p1453-1461, 9p