Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Euiseok Kum"'
Autor:
Hirak Mazumdar, Tae Hyeon Kim, Jong Min Lee, Euiseok Kum, Seungho Lee, Suho Jeong, Bong Geun Chung
Publikováno v:
Applied Sciences, Vol 11, Iss 21, p 10419 (2021)
The semiconductor manufacturing processes have been evolved to improve the yield rate. Here, we studied a sequential and comprehensive algorithm that could be used for fault detection and classification (FDC) of the semiconductor chips. A statistical
Externí odkaz:
https://doaj.org/article/0a4ed4f981044769bafd66ffef6a9a1d
Publikováno v:
Applied Sciences, Vol 11, Iss 12, p 5730 (2021)
Context-aware process mining aims at extending a contemporary approach with process contexts for realistic process modeling. Regarding this discipline, there have been several attempts to combine process discovery and predictive process modeling and
Externí odkaz:
https://doaj.org/article/dd3d7092c4c14ea7a8c4283bcbe58277
Autor:
Gil-Woo Song, Sungchai Kim, Sungwon Park, Taeyong Jo, Euiseok Kum, Jong-Hyun Hwang, Seonho Lee
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 34:17-24
In semiconductor manufacturing, data-driven methodologies have enabled the resolution of various issues, particularly yield management and enhancement. Yield, one of the crucial key performance indicators in semiconductor manufacturing, is mostly aff
Publikováno v:
Modeling Aspects in Optical Metrology VIII.
The trend to produce semiconductor devices having more complex nanostructures results in the increasing importance of exquisite systems measuring multiple Critical Dimensions (CDs) of nanostructures. However, from a practical point of view, it is dif
Autor:
Youngil Kang, Yoonsung Bae, Taeyong Jo, Tae-Joong Kim, Sukwon Lee, Young-Joo Lee, Doocheol Choi, Seunggun Byoun, Inho Kim, Euiseok Kum, Insoo Choi, Chang-Hoon Choi
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV.
Conventional semiconductor etching process control has been performed by separated steps: process, metrology, and feedback control. Uniformity of structures such as Critical Dimension (CD) is an important factor in determining completeness of etching
Autor:
Suho Jeong, Tae Hyeon Kim, Jongmin Lee, Seungho Lee, Hirak Mazumdar, Euiseok Kum, Bong Geun Chung
Publikováno v:
Applied Sciences, Vol 11, Iss 10419, p 10419 (2021)
Applied Sciences
Volume 11
Issue 21
Applied Sciences
Volume 11
Issue 21
The semiconductor manufacturing processes have been evolved to improve the yield rate. Here, we studied a sequential and comprehensive algorithm that could be used for fault detection and classification (FDC) of the semiconductor chips. A statistical
Publikováno v:
Computers & Industrial Engineering. 161:107632
The fault detection and classification (FDC) model is a prediction model that utilizes the sensor data of equipment to predict whether each wafer is faulty or not in the future, which is important to achieve a high yield and reduce the cost. To const
Autor:
Mazumdar, Hirak, Kim, Tae Hyeon, Lee, Jong Min, Kum, Euiseok, Lee, Seungho, Jeong, Suho, Chung, Bong Geun
Publikováno v:
Applied Sciences (2076-3417); Nov2021, Vol. 11 Issue 21, p10419, 13p
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing; Feb2021, Vol. 34 Issue 1, p17-24, 8p