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Autor:
Hyuk-Jun Lee, Eric Brause, Eui-Kang Lee, Hong-Seong Sohn, Chan-Gun Park, Jin-Goo Park, Uk Sun Hong
Publikováno v:
ECS Transactions. 11:95-100
Introduction: Process issues related to backside (BS) particles have risen in silicon wafer processing. Fig. 1 shows BS particles generated from a vacuum chuck during wafer transfer and a plate in vacuum chamber. International Technology Roadmap for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::23515c1e8fc269ac57171831574805a1
https://doi.org/10.1149/1.2779367
https://doi.org/10.1149/1.2779367
