Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Eugene Rabkin"'
Publikováno v:
Journal of The Electrochemical Society. 150:C646
Cu is currently used as a replacement for aluminum in IC interconnections. One of the challenges of integrated circuit (IC) interconnection technology is the planarization process that involves fine copper lines patterning; the most perspective techn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b16b279400fa6aefa599eef10333d659
https://doi.org/10.1149/1.1600465
https://doi.org/10.1149/1.1600465
Autor:
Rimma Lapovok, Vladimir V. Popov Jr., Yuanshen Qi, Anna Kosinova, Alex Berner, Chungie Xu, Eugene Rabkin, Roman Kulagin, Julia Ivanisenko, Brigitte Baretzky, Oksana V. Prokof'eva, A.N. Sapronov, D.V. Prilepo, Yan Beygelzimer
This study is inspired by the potential of application-designed aluminium-copper conductors. This work combines recently discovered advantages of hybrids with one constituent having a helical architecture with the benefits provided by severe plastic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10ee36287c8ab8bec1bb8cc16d8d0acd
