Zobrazeno 1 - 10
of 59
pro vyhledávání: '"Eu Poh Leng"'
Publikováno v:
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::804977065bd6b54fb7f769a0449c27a9
https://doi.org/10.1109/iemt55343.2022.9969488
https://doi.org/10.1109/iemt55343.2022.9969488
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
The bonding feasibility of Insulated Au-Flash PdCu (X-PdFlash) has proven to be successful in many of the previous studies shown in various papers. This has given the confidence of this collaborative project to explore into other areas of bonding app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::712e9f0d1a9b58db2f55bcf2f667b724
https://doi.org/10.1109/eptc.2016.7861545
https://doi.org/10.1109/eptc.2016.7861545
Publikováno v:
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.
With the success of developing insulated wire bond recipe in the conventional wire bond process for ball grid array (BGA) and quad flat package (QFP). The development of insulated wire bond process is moving further to explore into other areas of bon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10e742072eaca1928a81151622d6b684
https://doi.org/10.1109/iemt.2016.7761951
https://doi.org/10.1109/iemt.2016.7761951
Autor:
Siong Chin Teck, Tok Chee Wei, Mohd Rusli Ibrahim, Tan Lan Chu, Su Dan, Loh Wan Yee, Zhang Xi, Eu Poh Leng
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
The insulated Au-Flash PdCu wire (X-PdFLASH) study was first initiated by Freescale, Heraeus and Microbonds with the insulated technology from Microbonds since one year ago. Since then, continuous improvements in the wire processing was conducted by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f8017cdf228b657491e128d67e0e32b
https://doi.org/10.1109/eptc.2015.7412412
https://doi.org/10.1109/eptc.2015.7412412
Autor:
Eu Poh Leng, Mohd Rusli Ibrahim, Su Dan, Zhang Xi, Tan Lan Chu, Siong Chin Teck, Au Ying Kheng, Yow Kai Yun, Sarangapani Murali, Cheryl Lee, Tok Chee Wei
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
In the recent years, insulated wire bond is getting more attention by packaging technologist as another potential option of cost saving after Cu wire bond conversion due to its flexibility in wire bond without the fear of wire short. This is especial
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b13f656c5cedb81b35b7eca124b84530
https://doi.org/10.1109/eptc.2014.7028425
https://doi.org/10.1109/eptc.2014.7028425
Autor:
Au Ying Kheng, Sarangapani Murali, Tan Lan Chu, Zhang Xi, Cheryl Lee, Siong Chin Teck, Mohd Rusli Ibrahim, Tok Chee Wei, Su Dan, Robert Lyn, Eu Poh Leng
Publikováno v:
36th International Electronics Manufacturing Technology Conference.
Insulated wire bond is getting more attention nowadays by packaging technologist as another potential option of cost saving after Cu wire bond conversion due to its flexibility in wire bond without the fear of wire short. The process offers greater f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3344d2acdc76eeef0187154b8b9b262f
https://doi.org/10.1109/iemt.2014.7123122
https://doi.org/10.1109/iemt.2014.7123122
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
One of the key advantages to replace bare Cu wire with Pd Cu wire in semiconductor packages is to reduce corrosion risk against halogen from mold compound or substrate soldermask outgasing. However, existing wire bond recipe development methodology a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c08f02a34ec9b440e7284f5562c1308c
https://doi.org/10.1109/emap.2012.6507907
https://doi.org/10.1109/emap.2012.6507907
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
To ensure a reliable Cu wire bond on Al bond pad, Freescale has learnt that good IMC plays a very important role. However, unlike Au/Al IMC measurement method which has been well established, Cu/Al IMC measurement method is still relatively new in se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4a225210088fe0c0b75bbd32f533a80
https://doi.org/10.1109/emap.2012.6507929
https://doi.org/10.1109/emap.2012.6507929
Autor:
Low, Eu Poh Leng, A. D. Trigg, Sheryl Yong Puay Fen, Calvin Chua Hung Ming, V. P. Ganesh, Chai Tai Chong, Chen Ping, Sharon Chan Sok Mung, Tan Lan Chu, Jasmond Lee Thiam Kwee
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
The use of copper wire for wire bonding integrated circuits (ICs) has increased significantly in recent years, driven mainly by the dramatic increase in the cost of gold. The technical advantages and limitations, particularly with respect to reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::714921e40f72c865511536c9693d613b
https://doi.org/10.1109/eptc.2012.6507072
https://doi.org/10.1109/eptc.2012.6507072
Publikováno v:
2011 IEEE Regional Symposium on Micro and Nano Electronics.
Nowadays, increasing of gold price and decreasing of dielectric let copper and low-k dielectric materials become a new technology and are increasingly chosen as preferred interconnect insulated material in semiconductor applications. In this paper, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1953fc2f38d3b4b382e8af389f587518
https://doi.org/10.1109/rsm.2011.6088332
https://doi.org/10.1109/rsm.2011.6088332