Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Etsuo Mizushima"'
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 20:180-184
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e4921ef8974ae9c23607ffae8db792a
https://doi.org/10.5104/jiep.20.180
https://doi.org/10.5104/jiep.20.180
Autor:
Yukio Nakamura, Tomio Fukuda, Tomokazu Shimada, Shunsuke Tonouchi, Etsuo Mizushima, Toshiyuki Iijima
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
The next generation communication system, which is called 5G, is coming. With the introduction of 5G, dielectric material with low dielectric constant (Dk) and low dissipation factor (Df) is required to reduce transmission loss. And, the substrate is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdfaec834084741018762f3e235754be
https://doi.org/10.1109/ectc.2018.00012
https://doi.org/10.1109/ectc.2018.00012
Autor:
Etsuo Mizushima, Kakitani Minoru, Kohji Morita, Tanigawa Takao, Shin Takanezawa, Mami Shimada
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
The demand for low transmission loss materials applicable for printed circuit boards (PCBs) used in high-speed high-frequency devices has been increasing. Transmission loss consists of dielectric loss and conductor loss, and the reduction of both los
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1746e78aa5e0911264b665f21053d68
https://doi.org/10.1109/ectc.2018.00264
https://doi.org/10.1109/ectc.2018.00264