Zobrazeno 1 - 10
of 151
pro vyhledávání: '"Etsuji Ohmura"'
Publikováno v:
Journal of Advanced Mechanical Design, Systems, and Manufacturing, Vol 2, Iss 4, Pp 540-549 (2008)
In this study, “stealth dicing” (SD) was applied to ultra thin wafers 50 μm in thickness. A coupling problem composed of focused laser propagation in single crystal silicon, along with laser absorption, temperature rise and heat conduction was a
Externí odkaz:
https://doaj.org/article/94cb98dd341e4eee885917320a30171e
Autor:
Etsuji Ohmura
Publikováno v:
Materialwissenschaft und Werkstofftechnik. 44:472-480
In this study, a paraxial wave equation including light absorption term was solved by numerical calculation using the fast Fourier transform for irradiation of a Kerr medium irradiated by an ultrashort pulse laser. Using the absorbed energy distribut
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06e1ca394801adff9d6c81ab4cd682b9
https://doi.org/10.1002/mawe.201300152
https://doi.org/10.1002/mawe.201300152
Publikováno v:
Journal of Laser Micro/Nanoengineering. 8:102-109
Laser scribing generates a shallow median crack on a glass surface as a pre-processing for division without physical contact. It utilizes thermal stress caused by heating with the laser beam and by cooling with the water jet. In laser scribing, diffe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c8150337543a3ac8dbaba9d0cc94d52e
https://doi.org/10.2961/jlmn.2013.01.0020
https://doi.org/10.2961/jlmn.2013.01.0020
A012 Internal Processing of Glass by Ultrashort Pulse Laser and Analysis of Its Processing Phenomena
Autor:
Nobuaki Komatsubara, Etsuji Ohmura
Publikováno v:
Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21. :55-58
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d861f06aae65f4935eb118be0c3ad55c
https://doi.org/10.1299/jsmelem.2013.7.55
https://doi.org/10.1299/jsmelem.2013.7.55
Autor:
Etsuji Ohmura
Publikováno v:
Procedia CIRP. 5:7-12
When an ultrashort pulse laser is irradiated into the inside of a permeable medium, the refractive index changes dependently on the electric field strength. As a result, a self-focusing phenomenon occurs and self-focusing can lead to a filamentation.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1edf5369a32dc1b16c548a95c2e2f5af
https://doi.org/10.1016/j.procir.2013.01.002
https://doi.org/10.1016/j.procir.2013.01.002
Publikováno v:
SPIE Proceedings.
We investigated the relationship between size of melting marks formed inside glass and irradiation time and absorptivity of femtosecond laser beam. For this investigation the absorptivities for static exposure in fs-laser processing (femtosecond lase
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::643da754a6261fdb9b96fd769807e9ac
https://doi.org/10.1117/12.2211287
https://doi.org/10.1117/12.2211287
Publikováno v:
Precision Engineering. 34:70-75
Aluminosilicate glass, which has a relatively low thermal expansion coefficient, is used as a glass substrate in liquid crystal displays, whereas soda-lime glass is generally used for such items as windows. The aim of this study was to clarify the in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::acc0b90b76497ee185b46d7ca5a4ce43
https://doi.org/10.1016/j.precisioneng.2009.03.005
https://doi.org/10.1016/j.precisioneng.2009.03.005
Publikováno v:
Precision Engineering. 34:55-61
The thickness of the glass substrate used in liquid crystal displays continues to be decreased from its original thickness of 1.1 mm for the purpose reducing size and weight. The aim of this study was to clarify the influence of the glass substrate t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a84ec64a8f1a10d3395eb7397427551
https://doi.org/10.1016/j.precisioneng.2009.03.007
https://doi.org/10.1016/j.precisioneng.2009.03.007
Publikováno v:
Transactions of the Japan Society of Mechanical Engineers Series C. 75:3339-3346
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f4bdd7912656b048173143d1be3c77a
https://doi.org/10.1299/kikaic.75.3339
https://doi.org/10.1299/kikaic.75.3339
Publikováno v:
Precision Engineering. 32:301-308
In the laser scribing of glass a thermal stress is introduced into a glass plate by means of CO 2 laser irradiation. The glass plate is rapidly cooled down by water jet immediately after the irradiation. For the purpose of theoretical clarification o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::274870ec7fdf76348f59e6d373741420
https://doi.org/10.1016/j.precisioneng.2007.10.004
https://doi.org/10.1016/j.precisioneng.2007.10.004