Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Etkin Can"'
Publikováno v:
Journal of Natural Fibers, Vol 19, Iss 14, Pp 8688-8701 (2022)
In pursuit of new biobased materials for a sustainable world, glasswort (Salicornia europaea) was utilized in this study as a natural fiber to develop a biocomposite material. Glasswort (GW) reinforced high-density polyethylene (HDPE) composites at d
Externí odkaz:
https://doaj.org/article/ea52bba5fb964e98b42e99ea51683118
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b420b782cd489d9bb2ca32b8645fd8a1
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830214
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830214
In pursuit of new biobased materials for a sustainable world, glasswort (Salicornia europaea) was utilized in this study as a natural fiber to develop a biocomposite material. Glasswort (GW) reinforced high-density polyethylene (HDPE) composites at d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0d5d96ea154ad5892d7e0726631d7e1b
https://hdl.handle.net/11454/79645
https://hdl.handle.net/11454/79645
Publikováno v:
Journal of Parallel and Distributed Computing. 131:81-96
The configuration bitstream is a persistent source of vulnerability in FPGA designs, and thus FPGA vendors have implemented bitstream encryption. A number of attacks on these countermeasures have been demonstrated including direct probing of the conf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b07a4b35424b9f2bc53137c664536c8
https://doi.org/10.1016/j.jpdc.2019.04.002
https://doi.org/10.1016/j.jpdc.2019.04.002
Publikováno v:
ESSCIRC
We present an inherently secure FPGA that uses PUF-based hardware-entanglement of the configuration data and a side-channel resistant, self-timed logic style. The 3.14mm x 2.47mm testchip is fabricated in 9-metal 65nm bulk CMOS, contains the secure 1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2a3448749940dbb1f22c7f7b158629e
https://doi.org/10.1109/esscirc.2019.8902789
https://doi.org/10.1109/esscirc.2019.8902789
Publikováno v:
HOST
Protecting hardware IP from reverse engineering threats is becoming increasingly challenging with advances in reverse engineering techniques. Different camouflaged logic families based on multi-Vt transistors have been recently proposed to combat rev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3975053df1e67c5cbaec2875dd79f58a
https://doi.org/10.1109/hst.2018.8383896
https://doi.org/10.1109/hst.2018.8383896
Publikováno v:
HOST
Electronics counterfeiting is a significant and growing problem for electronics manufacturers, system integrators, and end customers. The widespread prevalence of counterfeit electronics in the manufacturing supply chain raises significant security c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1cbc7194d861b7e8cddeefba9db9df3
https://doi.org/10.1109/hst.2018.8383898
https://doi.org/10.1109/hst.2018.8383898
Publikováno v:
ISSCC
With the continued globalization of the IC manufacturing supply chain, securing that supply chain is becoming increasingly difficult and this opens the door to a myriad of security threats such as unauthorized production, counterfeiting, IP theft, an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7158ae2f4b8bed08ed3ba8e12ce6879b
https://doi.org/10.1109/isscc.2018.8310217
https://doi.org/10.1109/isscc.2018.8310217
Akademický článek
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Publikováno v:
2017 IEEE International Electron Devices Meeting (IEDM).
Integrated circuit counterfeiting is a significant and growing problem for electronics manufacturers, system integrators, and end users. The widespread prevalence of counterfeit ICs in the manufacturing supply chain raises significant security and re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0facb0e888a0fafa079365db168d7fa0
https://doi.org/10.1109/iedm.2017.8268523
https://doi.org/10.1109/iedm.2017.8268523