Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Etienne Navarro"'
Autor:
Rahul Sahay, Arief S. Budiman, Izzat Aziz, Etienne Navarro, Stéphanie Escoubas, Thomas W. Cornelius, Fergyanto E. Gunawan, Christian Harito, Pooi See Lee, Olivier Thomas, Nagarajan Raghavan
Publikováno v:
Nanomaterials, Vol 12, Iss 3, p 308 (2022)
Nanolaminates are extensively studied due to their unique properties, such as impact resistance, high fracture toughness, high strength, and resistance to radiation damage. Varieties of nanolaminates are being fabricated to achieve high strength and
Externí odkaz:
https://doaj.org/article/3d93291cf1104e6f810c35992bb861ae
Autor:
Etienne Navarro, Thomas W. Cornelius, Henry Proudhon, Rahul Sahay, Ihor Radchenko, Stéphanie Escoubas, Pooi See Lee, Nagarajan Raghavan, Arief S. Budiman, Olivier Thomas
Publikováno v:
Microelectronic Engineering
Microelectronic Engineering, 2023, 276, pp.111999. ⟨10.1016/j.mee.2023.111999⟩
Microelectronic Engineering, 2023, 276, pp.111999. ⟨10.1016/j.mee.2023.111999⟩
International audience; Face-centered cubic/body centered cubic (FCC/BCC) nanolaminates prepared by Accumulative Roll Bonding (ARB) have been extensively studied because of their unique mechanical properties. Recently, micro-beam bending experiments,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::08d66a0d4cf535b8b5ec34a1462475ac
https://hal.science/hal-04123370
https://hal.science/hal-04123370
Autor:
Ihor Radchenko, Wenxin Zhu, Liu Qing, Etienne Navarro, Rahul Sahay, Pooi See Lee, Nagarajan Raghavan, Olivier Thomas, Arief Suriadi Budiman, Kai Chen
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3062ff8f1166845100f95118d03c6010
https://doi.org/10.2139/ssrn.4101121
https://doi.org/10.2139/ssrn.4101121
Autor:
Rahul Sahay, Olivier P. Thomas, Pooi See Lee, S. Escoubas, Etienne Navarro, Nagarajan Raghavan, Thomas W. Cornelius, Arief Suriadi Budiman, Fergyanto E. Gunawan, Izzat Aziz, Christian Harito
Publikováno v:
MRS Advances
MRS Advances, Cambridge University Press, 2021, 6 (19), pp.495-499. ⟨10.1557/s43580-021-00108-y⟩
MRS Advances, 2021, 6 (19), pp.495-499. ⟨10.1557/s43580-021-00108-y⟩
MRS Advances, Cambridge University Press, 2021, 6 (19), pp.495-499. ⟨10.1557/s43580-021-00108-y⟩
MRS Advances, 2021, 6 (19), pp.495-499. ⟨10.1557/s43580-021-00108-y⟩
International audience; Nanoindentation is widely used to investigate elastic modulus, hardness and work hardening behaviour of nano- and micro-scale laminates. In this work, 16 nm accumulative roll bonding (ARB) Cu/Nb nanolaminate is used as a test
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2497ae4159171314e6e9ca0e9cbc4e13
https://hal.archives-ouvertes.fr/hal-03378495
https://hal.archives-ouvertes.fr/hal-03378495
Autor:
Jean-Pierre Raskin, Iuliana Radu, Thomas Pardoen, Alexandre Barthelemy, Yves Bréchet, Etienne Navarro
Publikováno v:
Japanese Journal of Applied Physics
Japanese Journal of Applied Physics, Japan Society of Applied Physics, 2015, 117 (8), ⟨10.1063/1.4913481⟩
Journal of Applied Physics, Vol. 117, p. 085305-1-085305-6 (2015)
Japanese Journal of Applied Physics, Japan Society of Applied Physics, 2015, 117 (8), ⟨10.1063/1.4913481⟩
Journal of Applied Physics, Vol. 117, p. 085305-1-085305-6 (2015)
International audience; AA simple model describing the hydrophilic adhesion between solid surfaces, with low roughness is proposed to explain both the influence of the interface roughness and quantity of water present at the interface on the work of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fac6bda87d6a9132b6b657751fd89c46
https://hal.archives-ouvertes.fr/hal-01211329
https://hal.archives-ouvertes.fr/hal-01211329
Autor:
Jean-Pierre Raskin, Alexandre Barthelemy, Yves Bréchet, Iuliana Radu, Etienne Navarro, Thomas Pardoen
Publikováno v:
Applied Physics Letters
Applied Physics Letters, American Institute of Physics, 2014, 105 (6), pp.4. ⟨10.1063/1.4893462⟩
Applied Physics Letters, Vol. 105, no.6, p. 061908 (2014)
Applied Physics Letters, American Institute of Physics, 2014, 105 (6), pp.4. ⟨10.1063/1.4893462⟩
Applied Physics Letters, Vol. 105, no.6, p. 061908 (2014)
International audience; The influence of the dynamics of the direct wafer bonding process on the curvature of the final wafer stack is investigated. An analytical model for the final curvature of the bonded wafers is developed, as a function of the d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::65f2a10e82794d3c3a02df43bb0b70e2
https://hal.archives-ouvertes.fr/hal-01121263
https://hal.archives-ouvertes.fr/hal-01121263
Autor:
Jean-Pierre Raskin, Alexandre Barthelemy, Etienne Navarro, Rene Moreau, Yves Bréchet, Iuliana Radu, Thomas Pardoen
Publikováno v:
Applied Physics Letters
Applied Physics Letters, American Institute of Physics, 2013, 103 (3), ⟨10.1063/1.4813312⟩
Applied Physics Letters, American Institute of Physics, 2013, 103 (3), ⟨10.1063/1.4813312⟩
International audience; During direct bonding, a thin gas film is trapped in-between the two wafers, leading to an interactive fluid/structure dynamics. A model of bonding dynamics is formulated using the plate approximation, Reynolds equation, and a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::25e8b5554de1c4335459e21993deada5
https://doi.org/10.1063/1.4813312
https://doi.org/10.1063/1.4813312