Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Etienne Barraud"'
Autor:
Didier Loison, Erik Brambrink, Etienne Barraud, Emilien Lescoute, Laurent Berthe, Tommaso Vinci, Alessandra Benuzzi Mounaix, Jean-Christophe Sangleboeuf, Benjamin Jodar, Yoann Raffray
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0119d100efc251e87dddd65a0605fe0
https://doi.org/10.26226/m.62a9d1ee9deaf4fdb6b3fdc3
https://doi.org/10.26226/m.62a9d1ee9deaf4fdb6b3fdc3
Autor:
X. Milhet, Hadi Bahsoum, Thibaut de Resseguier, Kokouvi Happy N'Tsouaglo, L. Signor, J. Baillargeat, Etienne Barraud
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Silver pastes sintering is a potential candidate for die bonding in power electronic modules which are built by stacking up layers of various materials having different coefficients of thermal expansion. Consequently, in operating conditions, thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a32cb93f9701bcf79990d7f1d140ece
https://doi.org/10.1109/ectc32696.2021.00106
https://doi.org/10.1109/ectc32696.2021.00106
