Ultra Small Integrated Optical Fiber Sensing System

Autor: Peter Van Daele, Kate Sugden, David J. Webb, Oliver Maskery, Sandeep Kalathimekkad, Jeroen Missinne, Graham Lee, Erwin Bosman, Bram Van Hoe, Geert Van Steenberge

Publikováno v: Sensors, Vol 12, Iss 9, Pp 12052-12069 (2012)

This paper introduces a revolutionary way to interrogate optical fiber sensors based on fiber Bragg gratings (FBGs) and to integrate the necessary driving optoelectronic components with the sensor elements. Low-cost optoelectronic chips are used to i

Externí odkaz: https://doaj.org/article/805d0f6d0005413d85ac06a1e3494b5e

Comparison of epoxy- and siloxane-based single-mode optical waveguides defined by direct-write lithography

Autor: Erwin Bosman, Jeroen Missinne, Ahmed Elmogi, Geert Van Steenberge

Publikováno v: Optical Materials. 52:26-31

This paper reports on the fabrication and characterization of single-mode polymer optical waveguides at telecom and SOI compatible wavelengths; by making a comparison between an epoxy and a siloxane polymer waveguide material system (both commerciall

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::47ba4208e9b7f265e08605684bc9a54f
https://doi.org/10.1016/j.optmat.2015.12.009

Scalable electro-photonic integration concept based on polymer waveguides

Autor: P.J. Harmsma, Mikko Karppinen, Markus Ortsiefer, Jeroen Antonius Maria Duis, Aidan Daly, Tia Korhonen, John Justice, Arjen Boersma, B.J. Offrein, Erwin Bosman, Brian Corbett, S. Wiegersma, Roger Dangel, Sander Dorrestein, G. Van Steenberge

Publikováno v: Chen, R.T.Schroder, H., Optical Interconnects XVI, 9753
Bosman, E, Van Steenberge, G, Boersma, A, Wiegersma, S, Harmsma, P, Karppinen, M, Korhonen, T, Offrein, B J, Dangel, R, Daly, A, Ortsiefer, M, Justice, J, Corbett, B, Dorrestein, S & Duis, J 2016, Scalable electro-photonic integration concept based on polymer waveguides . in H Schröder & R T Chen (eds), Optical Interconnects XVI ., 97530G, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 9753, Optical Interconnects XVI, San Francisco, United States, 15/02/16 . https://doi.org/10.1117/12.2225304

A novel method for fabricating a single mode optical interconnection platform is presented. The method comprises the miniaturized assembly of optoelectronic single dies, the scalable fabrication of polymer single mode waveguides and the coupling to g

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::299c8aee0136951465ede0c1c52dcca2
http://resolver.tudelft.nl/uuid:d1a74452-a0fa-40eb-aae4-7ee971dd0d86

Ultra Thin Optical Tactile Shear Sensor

Autor: Jan Vanfleteren, Jeroen Missinne, Peter Van Daele, Sandeep Kalathimekkad, Geert Van Steenberge, Erwin Bosman, Rik Verplancke, Bram Van Hoe

Publikováno v: Procedia Engineering. 25:1393-1396

Tactile shear sensors gain importance for example in the field of robotics and biomedical sciences. For these applications, an “artificial skin”-like solution is needed with very thin and flexible unobtrusive sensors that can be wrapped around ir

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ea5ef66d13929300f973815cdd1626dc
https://doi.org/10.1016/j.proeng.2011.12.344

Fine-Pitch Capabilities of the Flat Ultra-Thin Chip Packaging (UTCP) Technology

Autor: Jan Vanfleteren, Wim Christiaens, Erwin Bosman, Jonathan Govaerts

Publikováno v: IEEE Transactions on Advanced Packaging. 33:72-78

This paper describes the fine-pitch interconnection capabilities of the ultra-thin chip packaging (UTCP) technology, a technology under development for embedding thin chips in a flexible polyimide (PI) substrate. It allows for fully flexible electron

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::63321c17aef6f8f348823babd6f46dcc
https://doi.org/10.1109/tadvp.2009.2018134