Packaged single pole double thru (SPDT) and true time delay lines (TTDL) based on RF MEMS switches.

Autor: De Angelis, G., Lucibello, A., Marcelli, R., Catoni, S., Lanciano, A., Buttiglione, R., Dispenza, M., Giacomozzi, F., Margesin, B., Maglione, A., Erspan, M., Combi, C.

Publikováno v: 2008 International Semiconductor Conference; 2008, p227-230, 4p

Single-pole double-thru and true time delay lines in alumina packaging based on rf mems switches in silicon technology

Autor: Angelis, G., Lucibello, A., Marcelli, R., Catoni, S., Lanciano, A., Buttiglione, R., Dispenza, M., Flavio Giacomozzi, Margesin, B., Maglione, A., Erspan, M., Combi, C.

Publikováno v: Scopus-Elsevier
Romanian Journal of Information Science and Technology 12 (2009): 283–307.
info:cnr-pdr/source/autori:De Angelis G, Lucibello A, Marcelli R, Catoni S, Lanciano A, Buttiglione R, Dispenza M, Giacomozzi F, Margesin B, Maglione A, Erspan M, Combi C/titolo:Single-Pole Double-THRU and True Time Delay Lines in Alumina Packaging based on RF MEMS Switches in Silicon Technology/doi:/rivista:Romanian Journal of Information Science and Technology/anno:2009/pagina_da:283/pagina_a:307/intervallo_pagine:283–307/volume:12

Packaged MEMS devices for RF applications have been modelled, realized and tested. In particular, RF MEMS single ohmic series switches have been obtained on silicon high resistivity substrates and they have been integrated in alumina packages to get

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::85031ce5ee3bdadf7ba201475ea25ee0
http://www.scopus.com/inward/record.url?eid=2-s2.0-84878795860&partnerID=MN8TOARS

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