Zobrazeno 1 - 10 of 34 pro vyhledávání: '"Ernst, Leo"'
5
Conference
Interface crack propagation between epoxy moulding compound and copper.
Autor: Zhang, Weihai, Yang, Daoguo, Ernst, Leo, Zhang, Bingbing, Yang, Wen, Cai, Miao
Publikováno v: 2016 17th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2016, p1-8, 8p
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6
Conference
Aging of epoxy moulding compound ? Thermomechanical properties during high temperature storage.
Autor: Zhang, Bingbing, Johlitz, Michael, Lion, Alexander, Ernst, Leo, Jansen, K. M. B., Vu, Duc-Khoi, Weiss, Laurens
Publikováno v: 2016 17th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2016, p1-6, 6p
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7
Conference
Material characterization and nonlinear viscoelastic modelling of epoxy based thermosets for automotive application.
Autor: Gromala, P., Muthuraman, B., Ozturk, B., Jansen, K.M.B., Ernst, Leo
Publikováno v: 2015 16th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems; 2015, p1-7, 7p
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8
Conference
Cohesive zone modeling of mixed-mode delamination test.
Autor: Zhang, Bingbing, Yang, Daoguo, Ernst, Leo
Publikováno v: 2013 14th International Conference on Electronic Packaging Technology; 2013, p559-565, 7p
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9
Conference
Modeling of mixed-mode delamination by cohesive zone method.
Autor: Bingbing Zhang, Daoguo Yang, Ernst, Leo, Pape, Heinz
Publikováno v: 2013 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2013, p1-7, 7p
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10
Conference
2D/3D cohesive zone modeling of a mixed-mode delamination experiment.
Autor: Zhang, Bingbing, Yang, Daoguo, Ernst, Leo
Publikováno v: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013, p264-269, 6p
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