Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ernesto Antilano Jr."'
The creation of a robust wettable flank architecture in quad-flat no-leads (QFN) packages is satisfied by the step-cut configuration, where the exposed sidewall is plated with Sn. The step-cut singulation process induces Cu burrs, which can lead to s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7e30a5dcb4e7dd569464010d261251ca
Leadless semiconductor package with mechanical interlock is achieved by using a carrier with Cu base material, with selectively plated Ag layer on the leads and the pad. An embedded interlock on the plated layer is introduced, through masking, such t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9d74a5f2bf0fb2058461ab12e1206510
Satisfying the customer requirement of visually detectable solder joints for high reliability application necessitates the development of novel technologies such as the wettable flank technology. One approach involves the exposition of the sidewall v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8d1f191bdaf15478b933fd57459a5efb
Wettable flank technology is an emerging solution for the customer requirement of visually detectable solder joints for high reliability application. Herein, we present a strategy to realize this challenging technology. The use of ultra-short pulsed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4dc226ac1fb3de74350da02ba9a7b0b2