Výsledky vyhledávání - "Erik Veninga"

Advanced surface protection for improved reliability PCB systems (ASPIS)

Autor: Karl S. Ryder, Rimantas Ramanauskas, Erik Veninga, Asta Griguceviciene, Aleksandr Kosenko, Gregory C. H. Forrest, Rod Kellner, Martin Goosey, Andrew Ballantyne, Algirdas Selskis, Rima Tarozaite, Jurga Juodkazyte

Publikováno v: Circuit World, 1, 38, 21-29

PurposeThe purpose of this paper is to detail progress on the European Commission supported FP7 ASPIS project that is undertaking a multi‐faceted approach to develop novel and improved nickel‐gold (ENIG) solderable finish chemistries and processe

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b9c52286c9155f3b60cbfe46d64cfc7d
http://resolver.tudelft.nl/uuid:14f96754-6c3b-44bf-899b-74c118c83765

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Flipchip Bonding of Si Chip on Flexible PEN Foil using Novel Electronic 100 μm Pitch Fan-out Circuitry

Autor: Jeroen van den Brand, Roel Kusters, Erik Veninga, Tomas Podprocky, Andreas Dietzel

Publikováno v: Scopus-Elsevier

A novel, cost effective technology to manufacture high density embedded electronic circuitry is demonstrated. The process consists of laser photoablation of the circuitry into a substrate through a mask and subsequent filling using a polymer thick fi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ee3b3dfc38d8e937d9f2d7c149667753
https://doi.org/10.1557/proc-1030-g05-10

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